Polymer Hardmask for Fine Pattern Transfer

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Solution Overview

Problem

Conventional patterning materials and techniques struggle to achieve fine pattern transfer to substrates without collapse, especially in high integration designs of electronic devices, requiring advanced materials and processes for effective lithography and hardmask layers.

Innovation Solution

A polymer with specific structural units, including hydrogen-bondable functional groups and a divalent organic group, is used to form an organic layer composition that, when applied and heat-treated, creates a hardmask layer for pattern transfer, offering excellent etch resistance and solubility, enabling effective gap-fill and planarization characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional photoresist is used for patterning, then the process is simple, but fine pattern transfer to substrate without collapse cannot be achieved

Engineering Contradiction:

Improvefine pattern transfer precisionVSAvoidpatterning process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a composite hardmask layer structure consisting of an organic layer (formed from the polymer composition) and an inorganic layer (silicon-containing layer). This composite structure provides both the pattern transfer capability of the organic layer and the structural support/etch resistance of the inorganic layer, enabling fine pattern transfer without collapse while maintaining process feasibility

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The hardmask layer is formed in advance before the final etching process. The organic layer is deposited, heat-treated to form a robust structure, and then a silicon-containing layer is formed on top. This preliminary formation of the hardmask structure provides the necessary support for subsequent fine pattern transfer and etching operations

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If hardmask layer is formed to transfer fine pattern, then pattern transfer capability is improved, but etch resistance and structural stability may be compromised

Engineering Contradiction:

Improvepattern transfer capabilityVSAvoidetch resistance

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The composite structure of organic layer + silicon-containing inorganic layer combines the advantages of both materials. The organic layer provides good pattern transfer capability and solubility for processing, while the silicon-containing layer provides enhanced etch resistance and structural stability, resolving the contradiction between pattern transfer capability and etch resistance

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The polymer composition is specifically designed with controlled molecular weight (500-200,000) and functional group content (≥3 hydrogen-bondable groups per structural unit). These parameter optimizations enhance the etch resistance and heat resistance of the organic layer while maintaining its solubility and pattern transfer capability

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If polymer with hydrogen-bondable functional groups is used, then solubility and adhesion are improved, but molecular weight control becomes critical for performance

Engineering Contradiction:

Improvesolubility and adhesionVSAvoidmolecular weight control requirements

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent specifies a controlled molecular weight range (500-200,000) and minimum functional group content (≥3 hydrogen-bondable groups per structural unit). These parameter specifications optimize the balance between solubility (for easy coating), adhesion (through hydrogen bonding), and etch resistance, while providing clear guidance for polymer synthesis and quality control

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer-based organic layer composition provides enhanced etch resistance, heat resistance, and solubility, ensuring uniform thin film formation and pattern transfer without voids or pin-holes, improving the overall performance in electronic device manufacturing.

Implementation Method 1

at least one of A1 and A2 is substituted with a hydrogen-bondable functional group, and a sum of a number of the hydrogen-bondable functional group of A1 and a number of the hydrogen-bondable functional group of A2 is greater than or equal to 3

Methodology Applied

Scientific EffectHydrogen bonding: