Polymer H-IVUS Transducer Assembly for High-Resolution Deep Imaging
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Solution Overview
Problem
Intravascular ultrasound (IVUS) imaging suffers from poor spatial resolution compared to techniques like intravascular optical coherence tomography (IVOCT), and combined IVOCT-IVUS approaches are costly and complex.
Innovation Solution
A high-resolution intravascular ultrasound (H-IVUS) transducer assembly using a printed circuit with electrical signal conditioners and polymer-based convertors, manufactured via conventional microelectronics methods, providing high spatial resolution and maintaining depth penetration without the need for IVOCT.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional IVUS imaging is used, then depth penetration is maintained, but spatial resolution is poor
Solution Approach 1:
The patent changes the physical parameters of the transducer by using piezoelectric polymer materials with specific acoustic impedance matching to blood tissue, and by optimizing the resonant frequency and bandwidth parameters to achieve near-OCT resolution while maintaining depth penetration capability
Solution Approach 2:
The patent employs composite material structures including piezoelectric polymer convertors combined with acoustic matching layers and protective coatings, creating a multi-layer composite transducer assembly that optimizes both resolution and penetration properties
2Measurement precision
If combined IVOCT-IVUS is used, then spatial resolution is improved, but cost and complexity increase
Solution Approach 1:
The patent merges the functions of high-resolution imaging and depth penetration imaging into a single H-IVUS transducer system, eliminating the need for separate IVOCT and IVUS systems while achieving comparable resolution to OCT with the simplicity of ultrasound technology
Solution Approach 2:
The H-IVUS transducer is designed to provide multiple imaging capabilities (high resolution cross-sectional imaging, depth penetration, and real-time imaging) through a single device, making it universally applicable for various cardiovascular imaging needs without requiring multiple specialized systems
3Measurement precision
If combined IVOCT-IVUS is used, then spatial resolution is improved, but manufacturing cost increases
Solution Approach 1:
The patent adopts a disposable H-IVUS catheter design where the entire transducer assembly is pre-assembled and sealed in a sterile, cost-effective manner using conventional microelectronics manufacturing methods, eliminating the need for expensive reusable components and complex sterilization processes required by traditional IVUS systems
Solution Approach 2:
The patent replaces complex mechanical IVOCT systems with an electronically-based H-IVUS transducer that uses piezoelectric conversion and electronic signal processing, leveraging established microelectronics manufacturing techniques to achieve low-cost production while maintaining high imaging resolution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
H-IVUS achieves near optical coherence tomography-level resolution with low manufacturing costs, suitable for diagnosing and treating coronary and peripheral artery diseases, and assessing stent placement, while avoiding the limitations of combined IVOCT-IVUS systems.
Implementation Method 1
one or more formed in place convertors made of a polymer and configured to convert electrical energy to acoustic energy and acoustic energy to electrical energy
Data Source
AI summary
High-resolution intravascular ultrasound (H-IVUS) operates under a large acoustic bandwidth, provides high resolution while maintaining good depth penetration, and exhibits other favorable characteristics like focused imaging. A H-IVUS transducer assembly can be manufactured at a low cost using conventional methods commonly utilized in the microelectronics industry. The H-IVUS transducer assembly can include a printed circuit having one or more electrical signal conditioners. One or more convertors made of a polymer and configured to convert electrical energy to acoustic energy and acoustic energy to electrical energy can be formed in place away from the printed circuit. After construction, the one or more formed in place convertors are interfaced to the printed circuit with at least a conductive material.