Polymer Interconnects for IC Stacks via Conductive Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing processes for connecting integrated circuits (ICs) to substrates are cumbersome, especially when dealing with stacks of ICs of different sizes, as they require attaching metal wires to the substrate one at a time, which is time-consuming and labor-intensive, especially for large numbers of wires.
Innovation Solution
The use of polymer wires coated with a conductive layer, which can be fabricated simultaneously using techniques like electrodeposition, electroless deposition, or sputtering, replacing traditional metal wires and allowing for faster and cheaper interconnect formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal wires are used to connect ICs to substrates, then reliable electrical connection is achieved, but the bonding process becomes time-consuming and labor-intensive
Solution Approach 1:
Multiple individual wire bonding operations are merged into a single batch process. The patent describes forming a continuous conductive layer that simultaneously creates electrical connections for multiple ICs to the substrate, eliminating the need to bond each wire individually and thereby dramatically increasing productivity while maintaining connection reliability
Solution Approach 2:
The mechanical wire bonding process is replaced with a deposition-based conductive layer formation process. Instead of mechanically attaching individual metal wires through bonding, the patent uses electrodeposition or electroless deposition to form a continuous conductive layer that provides electrical connections, substituting a chemical/electrical process for a mechanical one
2Reliability
If traditional metal wire bonding is used, then electrical connectivity is established, but manufacturing cost increases due to labor-intensive processes
Solution Approach 1:
The patent replaces the labor-intensive mechanical wire bonding process with an automated deposition process. By using electrodeposition or electroless deposition to form conductive layers, the manufacturing process becomes more automated and less dependent on manual labor, thereby reducing manufacturing costs while maintaining electrical connectivity
Solution Approach 2:
The patent changes the fundamental parameter of how conductive paths are created - from discrete wire attachment to continuous conductive layer deposition. This parameter change enables batch processing and automation, significantly reducing per-unit manufacturing cost while preserving the electrical connectivity function
3Productivity
If polymer wires with conductive coating are used instead of metal wires, then manufacturing speed increases, but questions arise about mechanical strength and thermal performance
Solution Approach 1:
The patent employs a composite structure consisting of a polymer substrate with a conductive coating layer. The polymer provides flexibility and ease of processing, while the conductive coating (formed through electrodeposition or electroless deposition) provides the necessary electrical conductivity and enhanced mechanical strength, creating a composite material that balances multiple performance requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time and cost associated with bonding metal wires and allows for more efficient interconnect formation, enabling faster assembly of IC stacks with improved mechanical rigidity and thermal management.
Implementation Method 1
fabricated simultaneously using techniques like electrodeposition
Implementation Method 2
fabricated simultaneously using techniques like electrodeposition, electroless deposition
Implementation Method 3
fabricated simultaneously using techniques like electrodeposition, electroless deposition, or sputtering
Data Source
AI summary
An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130) which is conductive and/or is coated with a conductive material (144). Such interconnects replace metal bond wires in some embodiments. Other features are also provided.