Polymer Composition for Low-Dielectric Copper-Clad Laminates
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Solution Overview
Problem
Conventional materials used in printed wiring boards and semiconductor packages face challenges in balancing low dielectric/low dissipation factor, heat resistance, adhesiveness, and linear expansion coefficient, leading to issues like disconnection or connection failure due to mismatched linear expansion coefficients with copper wires.
Innovation Solution
A polymer with specific repeating structural units and a curable compound, which includes nitrogen-containing heteroaromatic rings and aromatic hydrocarbon groups, is formulated to achieve a well-balanced combination of low permittivity, low dissipation factor, and improved adhesiveness, heat resistance, and linear expansion coefficient.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether resin and fluororesin are used to achieve low dielectric/low dissipation factor and heat resistance, then low dielectric properties and heat resistance are improved, but adhesiveness to copper foil is insufficient and linear expansion coefficient difference from copper is large
Solution Approach 1:
The patent uses a composite material system combining polyphenylene ether resin with specific fluororesins (polytetrafluoroethylene, polyvinylidene fluoride, or carboxylic acid-modified polyvinylidene fluoride) in controlled ratios. This composite approach allows the material to simultaneously achieve low dielectric properties (from fluororesin), heat resistance (from polyphenylene ether), improved adhesiveness to copper (through modified fluororesin components), and adjusted linear expansion coefficient (by balancing the composite composition), thereby resolving the technical contradiction between low dielectric properties and adhesiveness/linear expansion match
Solution Approach 2:
The patent systematically varies the compositional parameters (ratios of polyphenylene ether resin to fluororesin, types of fluororesin used, addition of inorganic fillers) to optimize the balance between low dielectric properties and adhesiveness/linear expansion coefficient. By adjusting these parameters within specific ranges, the material achieves both excellent electrical properties and proper mechanical bonding to copper substrates, resolving the contradiction through parameter optimization
2Use of energy by moving object
If inorganic filler is added to reduce linear expansion coefficient difference from copper, then linear expansion coefficient match is improved, but adhesion to copper wire is reduced when addition amount is too large
Solution Approach 1:
The patent optimizes the inorganic filler content within specific ranges (typically 1-20 parts by weight per 100 parts of resin) to achieve the desired linear expansion coefficient match with copper while maintaining adequate adhesion. The patent also adjusts the particle size distribution and surface treatment of inorganic fillers to maximize their effectiveness in reducing linear expansion without compromising adhesion, resolving the contradiction through multi-parameter optimization
Solution Approach 2:
The patent creates a multi-component composite system where inorganic fillers are combined with polyphenylene ether resin and fluororesin in specific proportions. This composite structure allows the inorganic filler to effectively reduce linear expansion coefficient while the organic resin matrix maintains adhesion to copper substrates, resolving the contradiction by distributing functions across different material components
Data Source
AI summary
A polymer (A) includes a repeating structural unit represented by formula (1). R11 represents a divalent substituted or unsubstituted nitrogen-containing heteroaromatic ring; R12's independently represent a divalent substituted or unsubstituted aromatic hydrocarbon group; R13 represents a hydrocarbon group having 1 to 20 carbon atoms to which at least one group represented by formula (a1) is bonded in addition to two R12's; X1's independently represent —O—, —S—, or —N(R14)—; and R14 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group in which the hydrocarbon group or the halogenated hydrocarbon group is partially substituted with an oxygen atom, a sulfur atom, or both. In formula (a1), * represents a linkage to the R13; ** represents a bond to another structural unit in the polymer (A).