Polymer MEMS Package Structure With Plated Traces and EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in reducing size while maintaining performance, particularly in MEMS devices where high manufacturing costs and complex processes are involved due to the need for precise substrate stacking and conductive pattern formation.
Innovation Solution
A semiconductor package using a polymer substrate with injection-molded components and plated conductive patterns, allowing for cost-effective production by eliminating high-cost via hole drilling and reducing the number of manufacturing processes, while maintaining efficient electrical coupling and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional substrate stacking and via hole drilling are used, then precise electrical coupling is achieved, but manufacturing cost increases and production complexity increases
Solution Approach 1:
The patent combines the substrate and conductive patterns into a single integrated polymer substrate structure. The conductive patterns are formed directly on the polymer substrate through printing or coating techniques, eliminating the need for separate via hole drilling and metal layer deposition processes. This integration maintains electrical coupling precision while significantly reducing manufacturing cost and process complexity.
Solution Approach 2:
The patent replaces traditional mechanical drilling and metal deposition processes with chemical printing or coating methods. Conductive inks or pastes are directly applied to the polymer substrate in desired patterns, substituting complex mechanical machining and multiple coating steps with a simpler, more cost-effective printing process that achieves the same electrical coupling function.
2Productivity
If multiple separate manufacturing processes are used, then precise component placement is achieved, but production time increases and productivity decreases
Solution Approach 1:
The patent performs preliminary patterning of conductive traces directly on the polymer substrate before component mounting. The conductive patterns are pre-formed in their final positions and configurations, allowing components to be directly placed and connected without requiring subsequent via drilling or wire bonding operations. This preliminary action streamlines the production process while maintaining precise component placement.
Solution Approach 2:
The patent merges multiple discrete manufacturing steps (substrate preparation, conductive pattern formation, component mounting) into an integrated manufacturing process. The polymer substrate serves as both the structural base and the conductive interconnection medium, allowing components to be mounted and electrically connected in a single streamlined operation, thereby increasing production speed without sacrificing precision.
3Object-affected harmful factors
If traditional packaging structures are used, then electromagnetic shielding is achieved, but device size increases
Solution Approach 1:
The patent implements electromagnetic shielding at specific locations where it is most needed, rather than using comprehensive shielding structures. Conductive patterns are strategically placed to provide shielding in critical areas, and the polymer substrate itself can be formulated with electromagnetic shielding properties. This localized approach provides adequate shielding while minimizing the overall package size.
Solution Approach 2:
The patent uses composite polymer materials that inherently provide electromagnetic shielding properties. The polymer substrate can be formulated with conductive fillers or layered structures that offer shielding without requiring additional separate shielding components. This integrates the shielding function into the substrate itself, reducing overall device size while maintaining effective electromagnetic protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces manufacturing costs and simplifies the production process while maintaining performance by using injection-molded polymer substrates with plated conductive patterns, enabling efficient electrical signal transmission and effective electromagnetic shielding in MEMS devices.
Implementation Method 1
a first substrate comprising first conductive patterns electrically coupled to a micro-electro mechanical systems (MEMS) device
Implementation Method 2
injection-molded polymer substrates with plated conductive patterns, enabling efficient electrical signal transmission
Implementation Method 3
effective electromagnetic shielding in MEMS devices
Data Source
AI summary
A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.