Polymer Metal Impurity Analysis via Acid Extraction Separation
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Solution Overview
Problem
Current methods for analyzing metal impurities in resist materials used in semiconductor and liquid crystal display manufacturing have a high detection limit, making it difficult to detect trace amounts of metal components, which can deteriorate electrical characteristics and cause defects.
Innovation Solution
A method involving liquid-liquid extraction using an acid aqueous solution to separate and quantify metal components in a polymer composition, reducing the detection limit to 5 ppt or less by separating the polymer and metal components into distinct layers and using ICP-MS for analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a dilution method is used to analyze metal impurities in polymer composition, then the analysis process is simple, but the detection limit remains high (2 digits ppt)
Solution Approach 1:
The patent segments the analysis process into three distinct steps: (i) preparing a dispersion by mixing the polymer composition with an acid aqueous solution, (ii) separating the dispersion into a dispersoid layer containing the polymer and a dispersion medium layer containing the metal component, and (iii) quantifying the metal component in the dispersion medium layer. This segmentation enables the detection limit to be reduced to 5 ppt or less by isolating the metal component from the polymer matrix.
Solution Approach 2:
The patent extracts the metal component from the polymer composition by performing liquid-liquid extraction with an acid aqueous solution. The metal component is transferred to the dispersion medium layer, separating it from the polymer in the dispersoid layer. This extraction process concentrates the metal impurities and enables detection at 5 ppt or less, resolving the contradiction between simple analysis and low detection limit.
2Productivity
If metal impurities are present in resist material, then the manufacturing process can proceed, but the electrical characteristics of semiconductor devices deteriorate and defects occur
Solution Approach 1:
The patent performs preliminary analysis of metal impurities in the polymer composition before the resist material is used in semiconductor manufacturing. By detecting metal components at 5 ppt or less using the liquid-liquid extraction method, potential quality issues are identified in advance, allowing corrective actions to be taken before production, thus preventing electrical characteristic deterioration and device defects.
Solution Approach 2:
The patent establishes a feedback mechanism by quantifying metal components in the polymer composition and using this information to control and improve the quality of resist materials. The detection results provide feedback on the purity of the polymer composition, enabling continuous improvement of manufacturing processes to reduce metal impurities and enhance the reliability of semiconductor devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the detection of metal impurities at a lower limit, enabling the production of purified polymer products with reduced metal impurities, thereby improving the electrical characteristics and reducing defects in semiconductor devices.
Implementation Method 1
a step (i) of preparing a dispersion by mixing the polymer composition with an acid aqueous solution, a step (ii) of separating the dispersion into a dispersoid layer containing the polymer and a dispersion medium layer containing the metal component
Data Source
AI summary
A method of analyzing a metal component contained as an impurity in a polymer composition that contains a polymer and an organic solvent including a step (i) of preparing a dispersion by mixing the polymer composition with an acid aqueous solution, a step (ii) of separating the dispersion prepared in the step (i) into a dispersoid layer containing the polymer and a dispersion medium layer containing the metal component, and a step (iii) of quantifying the metal component contained in the dispersion medium layer separated in the step (ii).