Monolithic Polymer Modulator on PIC Platform

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Solution Overview

Problem

Current laser modulator integration techniques are inefficient, costly, and time-consuming due to the need for precise optical alignment of discrete components, which hinders cost-effectiveness and scalability in achieving high-speed performance.

Innovation Solution

A monolithic photonic integrated circuit (PIC) with a polymer modulator integrated directly onto the same platform as a laser, utilizing a 3-layer polymer structure with adiabatic transition and direct drive capabilities, eliminating the need for external driver circuits and enhancing coupling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If discrete lasers and modulators are used with optical alignment, then high-speed signaling above 10 Gbps can be attained, but the process is costly, time-consuming, and does not meet space/size requirements

Engineering Contradiction:

Improvesignaling speedVSAvoidintegration complexity

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent merges the laser and modulator functions into a single integrated device structure. The modulator is built directly onto the laser platform with waveguides optically coupled to the laser, eliminating the need for separate discrete components and manual optical alignment while maintaining high-speed signaling capabilities above 10 Gbps.

Inventive Principle:

Principle #5Merging (Combining)

2Speed

If discrete components are manually aligned and packaged, then high-speed performance can be achieved, but the process takes lots of time and is not cost-effective

Engineering Contradiction:

Improvesignaling speedVSAvoidmanufacturing efficiency

Core Design Contradiction:

SpeedVSProductivity

Solution Approach 1:

The patent combines multiple functions (laser, modulator, waveguides) into a single integrated device that can be manufactured using standard semiconductor fabrication processes. This eliminates time-consuming manual alignment and packaging steps, significantly improving manufacturing efficiency and reducing costs while maintaining high-speed performance.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If traditional modulator integration is used, then optical coupling can be achieved, but precise optical alignment is required which is costly and tedious

Engineering Contradiction:

Improveoptical coupling efficiencyVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent integrates the modulator structure directly onto the laser platform with waveguides that are optically coupled to the laser through a unified fabrication process. This eliminates the need for precise manual optical alignment while ensuring reliable optical coupling, making the manufacturing process much easier and more scalable.

Inventive Principle:

Principle #5Merging (Combining)

4Speed

If higher performance signaling is pursued with discrete components, then speeds above 10 Gbps can be attained, but space and size requirements are not met

Engineering Contradiction:

Improvesignaling speedVSAvoiddevice area

Core Design Contradiction:

SpeedVSArea of stationary object

Solution Approach 1:

The patent merges the laser and modulator into a single integrated device structure where the modulator is built directly onto the laser platform. This compact integration achieves high-speed signaling above 10 Gbps while significantly reducing the overall device area compared to discrete component arrangements.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high-speed, low-voltage operation with improved coupling efficiency and reduced complexity, achieving multi-GHz performance while minimizing size and cost, and eliminating the need for precise optical alignment.

Implementation Method 1

a shaped electro-optic polymer active component with a surface abutting a surface of a central portion of the passive core region, the shaped electro-optic polymer active component being polled to align dipoles and promote modulation of light

Methodology Applied

Scientific EffectElectro-optic effect: Electro-Optic Effects

Implementation Method 2

a second cladding layer enclosing the shaped electro-optic polymer active component and designed to produce adiabatic transition of light waves traveling in the passive core region into the shaped electro-optic polymer active component to travel the length of the shaped electro-optic polymer active component and return to the passive core region

Methodology Applied

Scientific EffectAdiabatic transition: Adiabatic Heating

Data Source

PatentUS11262605B2Active region-less polymer modulator integrated on a common PIC platform and method

Publication Date: 2022.03.01 LIGHTWAVE LOGIC INC

AI summary

A monolithic PIC including a monolithic laser formed in/on a platform and a polymer modulator monolithically built onto the platform and optically coupled to the laser. The modulator includes a first cladding layer, a passive core region with a surface abutting a surface of the first cladding layer, the core region extending to define an input and an output for the modulator. A shaped electro-optic polymer active component has a surface abutting a surface of a central portion of the core region. The active component is polled to align dipoles and promote modulation of light and has a length that extends only within a modulation area defined by modulation electrodes. A second cladding layer encloses the active component and is designed to produce adiabatic transition of light waves traveling in the core region into the active component to travel the length thereof and return to the core region.