Polymer Carrier Optical Module With Integrated Heat Dissipation
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Solution Overview
Problem
Existing optical modules fabricated with semiconductor materials are costly due to complex fabrication processes, necessitating a more economical solution without compromising performance.
Innovation Solution
An optical module using a polymer material carrier, which allows for low-cost fabrication through injection molding, incorporating a heat sink layer for thermal management and electrical conductivity, and a concave mirror for focusing optical radiation, along with a converting element and amplifier for energy conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor material is used for the carrier, then the optical module shows good performance, but the fabrication cost increases significantly
Solution Approach 1:
The patent changes the material parameter of the carrier from semiconductor material to polymer material. This parameter change allows the use of injection molding fabrication process instead of complex semiconductor fabrication processes, significantly reducing manufacturing cost while maintaining the required optical and electrical performance through proper material selection and design
Solution Approach 2:
The patent employs a composite structure where a polymer carrier is combined with a metal heat sink layer. The polymer provides cost-effective manufacturing and structural support, while the metal layer provides thermal management and electrical conductivity. This composite approach allows achieving good performance at lower cost by combining materials with complementary properties
2Ease of manufacture
If polymer material is used for the carrier, then the fabrication cost decreases, but the thermal management capability may be insufficient
Solution Approach 1:
The patent combines polymer material with metal heat sink material in a composite structure. The polymer carrier provides low-cost manufacturing through injection molding, while the integrated metal heat sink layer provides efficient thermal conduction and heat dissipation. This composite material approach resolves the contradiction by allowing each material to perform its strength
3Ease of manufacture
If the carrier surface is defined by molding, then the fabrication process is simplified, but the precision of component alignment may be affected
Solution Approach 1:
The patent incorporates alignment features and mounting structures directly into the carrier during the injection molding process. By preliminarily forming the precise geometric features, mounting holes, and alignment references in the molded carrier, the patent ensures accurate component alignment while maintaining the simplicity of the molding fabrication process
Solution Approach 2:
The patent optimizes the molding parameters and carrier geometry to achieve the required alignment precision. By carefully designing the carrier structure with integrated alignment features and selecting appropriate molding parameters, the patent achieves good manufacturing precision without compromising the cost advantages of molding fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical module achieves competitive performance at reduced costs, with efficient heat transfer and alignment capabilities, enabling cost-effective production while maintaining performance standards.
Implementation Method 1
a converting element adapted to convert received electrical energy into optical radiation or to convert received optical radiation into electrical energy
Implementation Method 2
The heat sink layer may provide a heat path extending from the third surface section via the second surface section into the first surface section in order to transfer heat of the amplifier from the third surface section into the second surface section, and the heat of the converter and the heat of the amplifier from the second surface section into the first surface section
Implementation Method 3
the mirror then emits thermal energy generated by the amplifier and/or the converting element over the mirror surface
Implementation Method 4
a mirror arranged in the beam path between the optical guiding element and the converting element and configured to optically connect the guiding element and the converting element
Implementation Method 5
The mirror is preferably concave and preferably focuses the optical radiation onto the converting element and/or onto the guiding element
Data Source
AI summary
The invention relates to an optical module 10) comprising a guiding element (30) adapted to guide optical radiation (P); a converting element (50, 200) adapted to convert received electrical energy into optical radiation or to convert received optical radiation into electrical energy; a mirror (70) arranged in the beam path (40) between the optical guiding element and the converting element and configured to optically connect the guiding element and the converting element; and a carrier (20) having a first surface section (22) for carrying the mirror and a second surface (23) section for carrying the converting element. The carrier is made of polymer material.