Small Diameter Polymer Optical Waveguide 3D Routing
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Solution Overview
Problem
Current optical interconnects face challenges in densely routing 3-dimensional optical fibers through tight spaces without significant losses due to scattering, connecting optics to light sources efficiently, and increasing the refractive index difference to enhance data transmission rates, particularly in small diameter fibers for compact devices like printed circuit boards and flexible substrates.
Innovation Solution
A novel process using laser-enhanced direct print additive manufacturing (LE-DPAM) combines fused deposition modeling (FDM) with micro-dispensing of rubber-like materials and picosecond laser subtraction to fabricate compact, 3-dimensional optical interconnects with small diameter fibers (70-μm to 12-μm core diameters) that can be printed along non-linear paths and embedded in optical cladding materials for uniform cooling, achieving high transmission rates and minimal bending losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical fibers are routed through tight spaces in 3-dimensional paths, then connectivity and data transmission capability are improved, but signal losses due to scattering increase
Solution Approach 1:
The patent transitions from traditional 2D planar routing to 3D spatial routing by embedding optical fibers within a three-dimensional printed cladding structure. This allows fibers to be positioned in multiple layers and angles, enabling complex routing paths through tight spaces while maintaining signal integrity through precise geometric control of the embedding medium.
Solution Approach 2:
The 3D printed cladding acts as an intermediary material that surrounds and protects the optical fibers. This cladding provides mechanical support, maintains fiber positioning, and reduces signal loss by providing a controlled refractive index environment that minimizes scattering while allowing flexible routing in three-dimensional space.
2Volume of moving object
If fiber diameter is reduced to increase interconnect density, then device compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent combines the fiber fabrication process with the cladding printing process into a single integrated manufacturing step. The fiber is deposited directly into the forming cladding structure, allowing the cladding to provide mechanical constraints that maintain consistent fiber diameter and positioning. This integration eliminates the need for separate, high-precision fiber drawing and positioning steps.
Solution Approach 2:
The patent utilizes control of printing parameters such as temperature, deposition rate, and material viscosity during the fused deposition modeling process to maintain consistent fiber diameter. By adjusting these parameters dynamically during printing, the system achieves precise dimensional control of small-diameter fibers without requiring post-processing or separate calibration steps.
3Speed
If refractive index difference is increased to enhance data transmission rates, then transmission speed is improved, but fiber complexity increases
Solution Approach 1:
The patent implements local quality by creating a cladding structure with spatially varying refractive index properties. The 3D printed cladding can incorporate materials or structural features that provide different refractive indices in different regions, allowing optimization of light confinement and transmission speed in specific areas without requiring complex overall fiber结构设计. This localized optimization achieves high transmission rates while maintaining relatively simple fiber geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process enables the production of optical interconnects with surface roughness below 100 nm and transmission rates exceeding 46% of commercial fibers, allowing for dense, efficient data transmission in compact devices and flexible optoelectronic applications, including large-scale integrated photonic computing devices.
Implementation Method 1
When fibers are embedded in an optical cladding material, the cooling is uniform, and the fiber is round thus eliminating one of the barriers of using optical fibers in printed circuit board optical interconnect applications
Implementation Method 2
A novel process using laser-enhanced direct print additive manufacturing (LE-DPAM) combines fused deposition modeling (FDM) with micro-dispensing of rubber-like materials and picosecond laser subtraction
Data Source
AI summary
A novel polymer optical waveguide and method of manufacturing is presented herein. A digitally manufactured process is described which utilizes a micro-dispensed UV optical adhesive as the contour guiding cladding, a fused deposition modeling technology for creating a core, and a subtractive laser process to finish the two ends of the optical interconnect. The optical waveguide can be printed directly on a circuit board in some embodiments. Alternatively, using a slightly modified process including a step to bond the optical fiber to the substrate, the optical interconnect can be manufactured on a flexible substrate.