Heat-Curable Polymer Paste for LED Light Transparency and Adhesion
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Solution Overview
Problem
Existing heat-curable polymer pastes struggle to form polymer layers with sufficient light transparency and adhesion for optical devices, particularly in LED applications.
Innovation Solution
A heat-curable polymer paste composition comprising a polyester resin with specific hydroxyl value and glass transition point, a methoxymethyl imino melamine crosslinking agent, and an organic solvent, applied and cured at controlled temperatures to form a transparent and adhesive polymer layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing heat-curable polymer paste formulations are used, then the polymer layer can be formed, but the light transparency and adhesion are insufficient for optical devices
Solution Approach 1:
The patent applies parameter changes by precisely controlling the hydroxyl value of the polyester resin (1-10 mgKOH/g) and the glass transition point (40-120°C), and by optimizing the ratio of crosslinking agent (1-30 parts by weight) to achieve the desired balance between light transparency and adhesion without excessive formulation complexity
Solution Approach 2:
The patent uses composite materials by combining polyester resin with specific crosslinking agents (methoxymethyl imino melamine or melamine compounds) in defined ratios, creating a composite polymer system that simultaneously achieves high light transparency and strong adhesion for LED optical devices
2Strength
If a polyester resin with higher hydroxyl value is used to improve adhesion, then adhesion increases, but light transparency deteriorates
Solution Approach 1:
The patent resolves this contradiction by changing the parameter of hydroxyl value to a specific range (1-10 mgKOH/g) that is low enough to maintain light transparency but high enough to ensure adequate adhesion when combined with the crosslinking agent, achieving an optimal balance between these two properties
3Adaptability or versatility
If the glass transition point of polyester resin is lowered to improve flexibility, then flexibility increases, but heat resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by setting the glass transition point within the range of 40-120°C, which provides sufficient flexibility for LED device assembly and operation while maintaining adequate heat resistance for the operating conditions of LED devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of polymer layers with high light transparency and adhesion, suitable for use in LED devices, including as a sealant and reflector, while allowing for optional pigmentation to create colored layers.
Implementation Method 1
a heat-curable polymer paste comprising: (i) 100 parts by weight of a polyester resin having a hydroxyl value of 1 to 10 mgKOH/g and a glass transition point (Tg) of 40 to 120° C., (ii) 1 to 30 parts by weight of a crosslinking agent comprising a methoxymethyl imino melamine
Implementation Method 2
The polymer layer with sufficient light transparency and adhesive can be formed by the present invention
Implementation Method 3
heating the applied polymer paste at 100 to 250° C.
Data Source
AI summary
A heat-curable polymer paste comprising: (i) 100 parts by weight of a transparent polyester resin having a hydroxyl value of 1 to 10 mgKOH/g and a glass transition point (Tg) of 40 to 120° C., (ii) 1 to 30 parts by weight of a crosslinking agent comprising methoxymethyl imino melamine represented as formula (I); (C2N3)[—N(H)(CH2OCH3)]n[—N(CH2OCH3)2]3-n (I) wherein n is 1 to 3, and (iii) 50 to 200 parts by weight of an organic solvent.