Polymer PCB Laser-Induced Graphene Circuit Manufacturing
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Solution Overview
Problem
Current methods for manufacturing printed circuit boards, such as subtractive and semi-additive methods, face environmental pollution and increased costs due to high water consumption and copper usage, while existing solutions like laser-induced graphene exhibit low electric conductivity.
Innovation Solution
A method involving a polymer material layer with a porous laser-induced graphene circuit pattern, where metal nanoparticles are deposited as a seed and a metal layer is formed through electroplating, electroless plating, or sputtering, followed by pressing to enhance conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If subtractive method is used to manufacture PCB, then copper foil can be etched to form circuit pattern, but water consumption increases greatly and chemical waste pollutes environment
Solution Approach 1:
The invention extracts only the necessary copper areas using laser-induced graphene as a mask, eliminating the need for extensive chemical etching. The laser directly removes material only where needed, avoiding the use of large amounts of water and chemical etchants that cause environmental pollution.
Solution Approach 2:
The invention replaces the chemical-mechanical etching system with a laser-based system. Instead of using chemical solutions to etch copper foil, a laser is used to directly ablate and remove material, substituting chemical processes with a physical laser field that does not generate harmful chemical waste.
2Ease of manufacture
If semi-additive method is used to manufacture PCB, then copper layer can be plated on substrate, but copper consumption increases
Solution Approach 1:
The invention performs preliminary laser-induced graphene formation on the substrate before copper deposition. This pre-formed graphene structure serves as a precise template that guides subsequent copper plating, ensuring copper is deposited only where needed and reducing overall copper consumption compared to semi-additive methods that require complete copper layer deposition followed by etching.
3Ease of manufacture
If laser induced graphene is used for circuit pattern, then manufacturing process is simplified, but electric conductivity is not high
Solution Approach 1:
The invention creates a composite structure by combining laser-induced graphene with metal nanoparticles and subsequent copper plating. The graphene provides the base structure and initial conductivity, while the metal nanoparticles and copper layer enhance the electrical conductivity, resulting in a composite material that maintains process simplicity while achieving high conductivity.
Solution Approach 2:
The invention applies local quality enhancement by depositing metal nanoparticles specifically at strategic locations on the graphene structure and then plating copper only in those areas. This localized approach enhances conductivity where most needed while maintaining the overall simplicity of the laser-induced fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method securely adheres the circuit pattern and achieves outstanding electric conductivity, reducing environmental impact and production costs by optimizing the manufacturing process.
Implementation Method 1
a predetermined area of the material layer is irradiated by laser beams in the laser induction reacting process
Implementation Method 2
a temperature of the predetermined area of the material layer rises up to at least 1500° C.
Implementation Method 3
forming a metal layer on the LIG of the circuit pattern
Implementation Method 4
forming a metal layer on the LIG of the circuit pattern in any one of electroplating, electroless plating, and sputtering manners
Implementation Method 5
pressing the circuit pattern
Data Source
AI summary
A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.