Polymer Powder Thermal Window for Warpage-Resistant 3D Models

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Solution Overview

Problem

Existing polymer powders used in 3D model production face issues with maintaining form in laser non-irradiation areas due to temperature unevenness in large-sized modeling devices, leading to warpage of the model objects.

Innovation Solution

A polymer powder with specific properties, including a melting point of 190°C or higher, a difference between melting point and onset temperature of less than 30°C, and a D50 particle size of 1-100 μm, is developed to maintain form and reduce warpage in large-sized modeling devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional polyamide powder is used in large-sized modeling devices, then the powder can be processed, but the powder cannot maintain its form in laser non-irradiation areas due to temperature unevenness, causing warpage

Engineering Contradiction:
Improveform maintenance of powderVSAvoidtemperature unevenness
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent changes the thermal parameters of the polyamide powder by specifying a melting point of 190°C or higher and controlling the difference between melting point and melting onset temperature to less than 30°C. This parameter optimization enables the powder to maintain form stability in temperature gradients while remaining processable

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition characteristics of the polyamide powder by controlling the narrow temperature range between melting onset and complete melting. This controlled phase transition behavior allows the powder to resist premature melting in laser non-irradiation areas while still enabling selective melting where needed

Inventive Principle:
Principle #36Phase transitions

2Manufacturing precision

If the melting point is raised to maintain form, then form stability improves, but the difficulty of processing increases

Engineering Contradiction:
Improveform stabilityVSAvoidprocessing difficulty
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent optimizes the melting point parameter to 190°C or higher for form stability, while simultaneously controlling the melting onset temperature to within 30°C of the melting point. This creates a narrow processing window that balances form stability with processability

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If the particle size is reduced to improve layer uniformity, then layer quality improves, but the surface area increases leading to greater temperature sensitivity

Engineering Contradiction:
Improvelayer uniformityVSAvoidtemperature sensitivity
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent specifies a D50 particle size of 1-100 μm that balances layer uniformity with temperature resistance. This particle size range provides sufficient uniformity for quality layers while limiting the surface area-to-volume ratio to reduce temperature sensitivity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer powder effectively maintains form in laser non-irradiation areas and reduces warpage in model objects, even in large-sized modeling devices, by optimizing temperature settings and preventing melting.

Implementation Method 1

a selective laser sintering method in which, after providing a powder layer, the layer is selectively melted by the laser

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

a selective absorption sintering method and a selectively inhibited sintering method, in which, after providing a powder layer, an electromagnetic radiation absorber or suppressor is printed

Methodology Applied
Scientific EffectElectromagnetic radiation absorption: Absorption (EM radiation)

Implementation Method 3

the layer is selectively melted by the laser and solidified at a position corresponding to the cross section of the object

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 4

the layer is selectively melted by the laser and solidified at a position corresponding to the cross section of the object, and these layers are adhered and laminated

Methodology Applied
Scientific EffectSolidification: Freezing

Data Source

PatentUS20250289927A1Polymer powder, method of producing same and method of producing 3-dimensional model object
Publication Date: 2025.09.18 TORAY INDUSTRIES INC
  • US20250289927A1 patent drawing
  • US20250289927A1 patent drawing
  • US20250289927A1 patent drawing

AI summary

A polymer powder includes a polyamide, wherein a melting point determined in differential scanning calorimetry is 190° C. or higher, a difference between the melting point and a melting onset temperature, which is defined in differential scanning calorimetry as a lowest temperature among temperatures at each of which a first temperature differential value of Heat Flow (W/g) observed between a peak top temperature of an endothermic peak, observed when 10 mg of powder is heated at a rate of 20° C./min from 30° C. in a nitrogen atmosphere, and a temperature point of −50° C. from the peak top, becomes −0.2 (W/g·° C.), is less than 30° C., and a D50 particle size is 1 μm or more and 100 μm or less.