Flexible Display Screen Packaging With Polymer RDL and Micro LEDs

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Solution Overview

Problem

Bendable AMOLED flexible display screens face device failure due to water and oxygen invasion, which causes cracking or delamination of the inorganic packaging layer, leading to light emission failure.

Innovation Solution

A display screen design featuring a redistribution layer with a flexible dielectric layer and metal interconnection structure, using micro or mini LEDs made of inorganic materials with low sensitivity to water and oxygen, and a polymer packaging layer for improved elasticity and bendability, eliminating the need for a fragile inorganic packaging layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an inorganic packaging layer is used to protect the OLED light emitting device from water and oxygen, then the device reliability is improved, but the bendability deteriorates due to cracking or delamination during bending

Engineering Contradiction:
Improveprotection from water and oxygenVSAvoidbendability
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the material parameter of the packaging layer from inorganic material to polymer material. This material substitution maintains the protective function against water and oxygen while fundamentally improving the bendability and flexibility of the display screen, eliminating the cracking and delamination issues associated with inorganic packaging layers during bending operations.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure combining polymer packaging layer with the OLED device and flexible substrate. This composite material approach integrates the protective properties of polymer materials with the light-emitting properties of OLED, achieving both reliability against environmental factors and enhanced mechanical flexibility for bendable applications.

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If a flexible display screen is bent, then the adaptability is improved, but the packaging layer cracks or delaminates causing device failure

Engineering Contradiction:
ImprovebendabilityVSAvoidpackaging layer integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent changes the material parameter of the packaging layer from inorganic material to polymer material. This material substitution maintains the protective function against water and oxygen while fundamentally improving the bendability and flexibility of the display screen, eliminating the cracking and delamination issues associated with inorganic packaging layers during bending operations.

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If an inorganic packaging layer is used, then the protection from water and oxygen is improved, but the elasticity deteriorates

Engineering Contradiction:
Improveprotection from water and oxygenVSAvoidelasticity
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameter of the packaging layer from inorganic material to polymer material. This material substitution maintains the protective function against water and oxygen while fundamentally improving the bendability and flexibility of the display screen, eliminating the cracking and delamination issues associated with inorganic packaging layers during bending operations.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20240030205A1Display Screen, Method for Manufacturing Same, and Display Terminal
Publication Date: 2024.01.25 HUAWEI TECH CO LTD
  • US20240030205A1 patent drawing
  • US20240030205A1 patent drawing
  • US20240030205A1 patent drawing

AI summary

A display screen includes a redistribution layer, a plurality of light emitting units, and a plurality of driver chips. The redistribution layer includes a flexible dielectric layer and a metal interconnection structure disposed in the flexible dielectric layer. The light emitting unit includes at least one light emitting chip. The light emitting diode is disposed on the redistribution layer. A pad of the light emitting chip is bonded to the metal interconnection structure. The plurality of driver chips are disposed on the redistribution layer. A pad of the driver chip is bonded to the metal interconnection structure. One driver chip is electrically connected to light emitting chips in the same light emitting unit by using metal interconnection structure, and the driver chip is configured to drive the light emitting chip to emit light.