Polymer Removal Solution for Metal-Safe Wafer Cleaning
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Solution Overview
Problem
Existing methods for removing adhesive polymers in semiconductor manufacturing cause damage to metal layers and have inefficient removal rates, particularly when dealing with cured adhesive polymers on circuit surfaces.
Innovation Solution
A process solution comprising a polar aprotic solvent, a fluorine-based compound, and a sulfur-containing compound is used to minimize metal layer damage while enhancing adhesive polymer removal, specifically targeting silicone-based resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to remove adhesive polymers, then removal capability is achieved, but metal layer damage occurs
Solution Approach 1:
The patent changes the chemical parameters of the removal solution by specifying precise compositional ratios (70-95 wt% first solvent, 5-30 wt% second solvent, 0.1-5 wt% fluorinated compound) to optimize both removal capability and metal layer protection, resolving the contradiction between effective polymer removal and prevention of metal damage
Solution Approach 2:
The patent creates a composite chemical solution combining multiple solvents (polar aprotic and non-polar) with fluorinated compounds to achieve synergistic effects that enable effective adhesive removal while protecting metal layers, addressing the contradiction between removal efficiency and metal layer integrity
2Productivity
If strong removal agents are used to remove cured adhesive polymers, then removal rate improves, but metal film damage increases
Solution Approach 1:
The patent optimizes the concentration parameters of active ingredients (fluorinated compounds at 0.1-5 wt%) and solvent ratios to achieve high removal rates for cured polymers while controlling the aggressiveness of the solution to prevent metal film damage
Solution Approach 2:
The patent uses a multi-component solvent system as an intermediary that mediates between the need for strong polymer removal and the need to protect metal films, with the solvent combination providing selective action that spares metal while attacking polymer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes adhesive polymers without damaging metal layers, maintaining high removal efficiency and reducing metal film damage, as demonstrated by the experimental results.
Implementation Method 1
a polar aprotic solvent
Implementation Method 2
a fluorine-based compound
Implementation Method 3
a sulfur-containing compound
Data Source
AI summary
The present disclosure relates to a process solution for polymer processing, containing a polar aprotic solvent, a fluorine-based compound, and a sulfur-containing compound. The process solution for polymer processing may have excellent storage stability and minimize damage to the metal layer while improving an ability to remove the adhesive polymer remaining on a circuit surface of a semiconductor wafer.