Polymer Removal Composition for Fast Wafer Cleaning Without Corrosion
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Solution Overview
Problem
Existing compositions for removing adhesive polymers from semiconductor wafers are inefficient and can cause metal corrosion, particularly when dealing with reticulated polymers, and existing solutions have slow removal rates and damage metal films or bump balls.
Innovation Solution
A composition comprising a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound, which effectively breaks down and dissolves silicone polymers, preventing metal corrosion by adjusting the pH and enhancing solubility, thereby improving removal rates and minimizing damage to metal films and bump balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional composition for removing adhesive polymers is used, then the polymer removal process can be performed, but the removal rate is slow for reticulated polymers
Solution Approach 1:
The patent changes the chemical parameters of the removal composition by incorporating specific fluorinated alkyl compounds with particular molecular structures and concentrations, which significantly accelerates the removal rate of reticulated polymers compared to conventional compositions
Solution Approach 2:
The patent creates a composite chemical composition by combining fluorinated alkyl compounds, polar aprotic solvents, and non-polar solvents in specific ratios, achieving synergistic effects that dramatically improve polymer removal efficiency
2Ease of operation
If the adhesive polymer is peeled off from the circuitry surface, then the support can be removed, but metal films or bump balls are likely to be damaged due to metal corrosion
Solution Approach 1:
The fluorinated alkyl compound acts as an intermediary that selectively attacks and dissolves the adhesive polymer while being inert toward metal films and bump balls, preventing corrosion during the removal process
Solution Approach 2:
The composition creates a chemically selective environment where the fluorinated alkyl compound provides protection to metal components by not reacting with them, while simultaneously enabling polymer removal
3Strength
If the adhesive polymer is thermally cured to securely attach the support to the wafer, then the attachment strength is improved, but the cured adhesive polymer is likely to remain on the circuitry surface after peeling
Solution Approach 1:
The fluorinated alkyl compound selectively extracts and dissolves the cured adhesive polymer from the circuitry surface through chemical action, leaving the surface clean without compromising the previously achieved attachment strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high-speed removal of silicone-based polymers, including reticulated types, while effectively preventing metal corrosion, ensuring efficient polymer removal without damaging metal components.
Implementation Method 1
A composition comprising a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound, which effectively breaks down and dissolves silicone polymers
Implementation Method 2
preventing metal corrosion by adjusting the pH
Data Source
AI summary
Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound.