Polymer Resin Composition Balancing Dielectric Loss, Tg, and Solubility
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Solution Overview
Problem
Existing resins used in printed wiring boards face challenges in achieving a balance between low dielectric constant and loss tangent, high glass transition point, and high solubility in organic solvents, making it difficult to satisfy all these properties simultaneously.
Innovation Solution
A novel polymer with a specific repeating unit derived from a polymerizable compound, combined with a resin composition that includes a thermosetting resin and an active ester-based curing agent, is developed to achieve a low dielectric constant, low dielectric loss tangent, and high glass transition point while maintaining high solubility in organic solvents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If resins with low dielectric constant and low dielectric loss tangent are used, then transmission loss is reduced, but heat resistance (glass transition point) deteriorates
Solution Approach 1:
The patent uses a composite resin system combining polyarylate (providing low dielectric constant and loss tangent) with polyimide or other heat-resistant polymers (providing high glass transition point). This composite approach allows the material to simultaneously achieve low transmission loss and high heat resistance, resolving the contradiction between these two properties.
Solution Approach 2:
The patent modifies the chemical structure and composition parameters of the resin, specifically adjusting the ratio of polyarylate to heat-resistant polymer components, and selecting specific aromatic ring structures to optimize both dielectric properties and thermal stability. By changing these parameters, the resin achieves a balance between low dielectric loss and high glass transition point.
2Temperature
If resins with high glass transition point are used, then heat resistance is improved, but solubility in organic solvents deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating heat-resistant polymer components with specific functional groups that maintain high glass transition point while introducing solubilizing groups that enhance solubility in common organic solvents like MEK, toluene, and cyclohexanone. This allows the resin to be processed at high concentrations without sacrificing heat resistance.
Solution Approach 2:
The patent uses specific polymer structures that act as intermediaries, combining heat-resistant aromatic structures with solubilizing side chains or functional groups. These intermediary structures enable the resin to achieve both high heat resistance and good solubility, facilitating easy processing while maintaining thermal stability.
3Loss of energy
If resins with low dielectric constant are used, then transmission loss is reduced, but solubility in organic solvents deteriorates
Solution Approach 1:
The patent creates a composite resin system where polyarylate provides low dielectric constant for reduced transmission loss, while the incorporated heat-resistant polymer component with solubilizing groups ensures good solubility in organic solvents. This composite structure resolves the contradiction between low dielectric loss and high solubility.
Solution Approach 2:
The patent adjusts the compositional parameters and chemical structure of the resin to achieve optimal balance between dielectric properties and solubility. By modifying the ratio of components and selecting specific molecular structures, the resin simultaneously achieves low dielectric constant for low transmission loss and high solubility for easy processing.
Data Source
AI summary
An object of the present invention is to provide a polymer that has excellent heat resistance and dielectric properties and can be dissolved in an organic solvent at a high concentration, a resin composition containing the same, and a molded body thereof. The polymer of the present invention has a repeating unit derived from a polymerizable compound of the following formula (I) (In the formula, X1 and X2 each independently represent a C3 to C6 branched alkyl group, a C3 to C6 cyclic alkyl group, a C3 to C6 branched alkoxy group, or a C3 to C6 cyclic alkoxy group, n represents 0 or 1, Z1 and Z2 each independently represent a single bond or a C1 to C3 alkylene group, each R independently represents an organic group or a halogeno group, m1 and m2 each independently represent any integer of 0 to 4, and Y represents a polymerizable functional group).