Thermally Conductive Polymer Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
Thermal management in semiconductor device packaging is challenging due to the inability of typical encapsulation mold compounds to conduct heat effectively, leading to heat trapping near the device die, and the limited use of metal heat sinks to avoid electrical shorts.
Innovation Solution
Incorporating a thermally conductive polymer structure that is electrically insulating, allowing for flexible placement and heat transport from the semiconductor device die to the exterior of the package, using thermally conductive polymers such as polyphenylene vinylene or polyacetylene, which can be affixed to the die or included in an overmolding compound slug.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal heat sinks and conduits are used for thermal management, then heat dissipation is improved, but electrical shorting risk increases and placement flexibility is reduced
Solution Approach 1:
The patent introduces a thermally conductive polymer as an intermediary material between the semiconductor die and the external environment. This polymer serves as a mediator that transfers heat effectively while maintaining electrical insulation, thus resolving the contradiction between heat dissipation and electrical shorting risk.
Solution Approach 2:
The invention uses composite materials by incorporating thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) into a polymer matrix. This creates a material that combines thermal conductivity with electrical insulation properties, enabling effective heat dissipation without electrical shorting.
2Temperature
If metal heat sinks and conduits are used for thermal management, then heat dissipation is improved, but placement flexibility is reduced
Solution Approach 1:
The thermally conductive polymer acts as a flexible intermediary that can be molded into various shapes and configurations. Unlike rigid metal heat sinks, this polymer material can adapt to different package designs and die placements, maintaining placement flexibility while providing effective thermal management.
Solution Approach 2:
The invention changes the physical parameters of the thermal management material by using a polymer-based composite instead of metal. This allows the material to have different thermal conductivities, viscosities, and mechanical properties that can be tuned for specific applications, thereby improving adaptability and placement flexibility.
3Device complexity
If typical encapsulation mold compounds are used, then packaging simplicity is maintained, but heat conduction capability is insufficient
Solution Approach 1:
The patent enhances the typical encapsulation mold compound by incorporating thermally conductive fillers into the polymer matrix. This creates a composite material that maintains the simplicity of the molding process while significantly improving heat conduction capability. The composite material can be processed using standard molding techniques, thus preserving packaging simplicity.
Solution Approach 2:
The invention modifies the thermal parameters of the encapsulation material by adding thermally conductive fillers. This changes the thermal conductivity of the mold compound from poor to adequate or good, while maintaining other processing parameters such as viscosity, cure characteristics, and molding temperature within acceptable ranges for standard manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation from the semiconductor device die to the exterior of the package without risking electrical shorts, providing a flexible and effective thermal management mechanism for high-power devices.
Implementation Method 1
thermally conductive polymer structure... allowing for flexible placement and heat transport from the semiconductor device die to the exterior of the package
Data Source
AI summary
A heat transportation mechanism that is thermally conductive, but not electrically conductive, is provided so as to permit transportation of heat generated by a semiconductor device die to the exterior of a semiconductor device package. Embodiments can use a thermally conductive polymer structure, added to the package mold compound, to transport heat through the mold compound. The thermally conductive polymer structure can be fixed to the semiconductor device die prior to molding or can be included in an overmolding compound slug prior to performing the overmolding process. Flexibility of placement of the thermally conductive polymer structure is provided by using dielectric compounds.