Conductive Polymer Socket Contacts for Dense Power and Signal Routing
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Solution Overview
Problem
Existing socket interconnect systems face challenges with high component density and layout requirements due to current carrying limitations and insufficient electrical shielding in conductive elastomeric columns, particularly in grid array configurations.
Innovation Solution
The use of a socket assembly with primary and secondary conductive polymer columns of varying shapes and sizes, where secondary columns provide enhanced current carrying capacity and act as shielding fences to isolate primary columns, addressing both power transmission and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductive elastomeric columns are used in a grid array configuration, then component density is increased, but current carrying capacity is limited
Solution Approach 1:
The interconnect device segments the conductive columns into two distinct functional types: signal columns for data transmission and power columns for current carrying. This segmentation allows each column type to be optimized for its specific function, with power columns having larger cross-sectional areas to handle higher currents while signal columns maintain smaller sizes for high-density packing.
Solution Approach 2:
Different regions of the grid array are assigned different column characteristics. Power columns are strategically positioned and sized with larger cross-sections in areas requiring high current capacity, while signal columns use smaller cross-sections. This local differentiation of column properties enables the system to achieve both high component density and sufficient current carrying capacity where needed.
2Quantity of substance
If conductive elastomeric columns are spaced closely in a grid array, then component density is increased, but electrical shielding is insufficient
Solution Approach 1:
Ground columns are introduced as intermediary elements between signal columns to provide electrical shielding. These ground columns act as mediators that intercept and dissipate electromagnetic interference, protecting sensitive signal columns from electrical noise. The ground columns are positioned strategically within the grid array to create shielding zones without significantly increasing the overall footprint.
Solution Approach 2:
The grid array is segmented into functional zones with different column types arranged in specific patterns. Signal columns, power columns, and ground columns are distributed throughout the array, creating a structured layout where shielding columns are positioned to protect vulnerable signal transmission paths while maintaining high overall component density.
3Power
If more conductive elastomeric columns are used for power transmission, then current carrying capacity is improved, but device complexity increases
Solution Approach 1:
Rather than uniformly increasing the number and size of all columns, the invention applies local quality by enlarging only the power columns in specific locations where high current capacity is required. Signal columns maintain their smaller, optimized dimensions. This selective scaling of column sizes based on local functional requirements achieves the necessary power transmission capability without proportionally increasing the total column count or device complexity.
Data Source
AI summary
A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.


