Low-Dielectric Polymer Substrate Ion Beam Adhesion
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Solution Overview
Problem
Conventional Flexible Copper Clad Laminated Substrates face issues with polymer film peeling during high-temperature processes and require separate adhesive layers for metal deposition, leading to increased thickness and limited adhesion, especially with fluorine-containing polymers having low dielectric properties.
Innovation Solution
A low dielectric polymer substrate with a surface modified layer formed by ion beam pretreatment, allowing direct deposition of metal or ceramic layers without additional adhesives, using gases like hydrogen or argon to enhance adhesion and maintain substrate integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a separate adhesive layer is formed to improve adhesion between polymer and metal, then adhesion is improved, but thickness increases
Solution Approach 1:
The patent extracts and eliminates the separate adhesive layer from the conventional structure. By using ion beam pretreatment on the polymer substrate surface, it creates a directly adhesive surface without requiring an intermediate adhesive layer, thus reducing thickness while maintaining adhesion functionality.
Solution Approach 2:
The patent changes the surface parameters of the polymer substrate through ion beam treatment. This modification alters the surface energy and morphology parameters, enabling direct adhesion of metal layers without additional adhesive materials, thereby solving the thickness-adhesion contradiction.
2Loss of energy
If fluorine-containing polymer is used to achieve low dielectric, then dielectric constant is reduced, but adhesion to metal layer deteriorates
Solution Approach 1:
The patent applies preliminary ion beam pretreatment to the fluorine-containing polymer surface before metal deposition. This preliminary action modifies the surface properties to enhance adhesion, allowing the use of low-dielectric fluorine-containing polymers without suffering from poor adhesion issues.
Solution Approach 2:
The ion beam treatment changes the surface energy and chemical composition parameters of the fluorine-containing polymer. This parameter modification enables the polymer to maintain its low dielectric constant while achieving improved adhesion to metal layers through surface modification rather than bulk composition change.
3Strength
If conventional surface treatment with ultraviolet rays is applied to improve adhesion, then adhesion is slightly improved, but usability is limited
Solution Approach 1:
The patent replaces the conventional ultraviolet radiation method with ion beam treatment. This substitution provides more effective and versatile adhesion enhancement, overcoming the limitations of UV treatment and expanding usability for various metal deposition applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves adhesion between the polymer and metal or ceramic layers, reducing thickness and signal loss while maintaining flexibility, suitable for high-speed communication devices and server boards.
Implementation Method 1
a surface modified layer formed by ion beam pretreatment of the surface of the polymer layer
Data Source
AI summary
The present disclosure provides a low dielectric polymer substrate and a preparation method thereof. More specifically, the present disclosure provides a low dielectric polymer substrate to which metal or ceramic may be deposited with high adhesion without a separate adhesive layer through surface modification of a polymer substrate and a preparation method thereof.