Polymer Substrate Layer Arrangement for Friction Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing friction-increasing connection technologies face challenges in achieving high adhesion coefficients and corrosion resistance, particularly in applications where magnetic interference and electrostatic discharge are concerns, and they often require strong substrates that are not suitable for all environments.
Innovation Solution
A layer arrangement featuring a substrate made of an organic polymer with a metallic binder phase and hard material particles, which provides a non-magnetic, corrosion-resistant, and electrically insulated connection by using a non-magnetic substrate and specific metal alloys like nickel-phosphorus and copper-tin, allowing for high adhesion coefficients comparable to metal-based solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal foil substrate is used for friction-increasing connection, then high strength and adhesion are achieved, but magnetic interference and electrostatic discharge risks occur
Solution Approach 1:
The substrate material is changed from metal to organic polymer, fundamentally altering the magnetic properties from ferromagnetic to non-magnetic, thereby eliminating magnetic interference while maintaining mechanical functionality
Solution Approach 2:
A composite structure is created with organic polymer substrate combined with metallic binder phase and hard material particles, achieving both non-magnetic properties and high friction-increasing capability through the functional layer
2Strength
If a metal foil substrate is used for friction-increasing connection, then high strength is achieved, but corrosion resistance deteriorates
Solution Approach 1:
The substrate material is changed from metal to organic polymer, fundamentally altering the corrosion resistance from poor to excellent, as organic polymers are inherently resistant to corrosion while maintaining mechanical strength through fiber reinforcement
Solution Approach 2:
A fiber-reinforced organic polymer composite is used, combining the corrosion resistance of organic materials with the mechanical strength of reinforcing fibers, creating a substrate that resists both corrosion and mechanical failure
3Strength
If a metal foil substrate is used for friction-increasing connection, then high adhesion coefficient is achieved, but electrical insulation is lost
Solution Approach 1:
The substrate material is changed from conductive metal to insulating organic polymer, fundamentally altering the electrical properties from conductive to insulating, thereby preventing electrostatic discharge while maintaining friction-increasing functionality
Solution Approach 2:
The composite structure uses organic polymer as substrate with metallic binder phase only in the functional layer, ensuring electrical insulation at the substrate level while maintaining adhesion functionality through the controlled metallic binder phase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a significant increase in the coefficient of adhesion and corrosion resistance while being non-magnetic, reducing the risk of electrostatic discharge and enabling use in sensitive environments like magnetic resonance tomographs.
Implementation Method 1
a layer arrangement for the friction-increasing connection of components to be joined (81, 82), which has a substrate (20) with a base body (21) made of an organic polymer and at least one functional layer (41, 42) connected to the substrate (20) with a metallic binder phase (51, 52) and hard material particles (61, 62) fixed in the metallic binder phase (51, 52)
Implementation Method 2
Particles are fixed to the spring-elastic film by means of a binding phase, the binding phase having a strength that corresponds to the strength of the workpieces to be joined. EP 1 564 418 B1 shows a connecting element for the friction-increasing connection of workpieces
Data Source
AI summary
The invention relates to a layer arrangement (10) for connecting components (81, 82) to be joined so as to increase friction, having a substrate (20) with a main part (21) made of an organic polymer and having at least one functional layer (41, 42) which is connected to the substrate and which comprises a metal binding phase (51, 52) and solid particles (61, 62) fixed in the metal binding phase. The invention also relates to a method for producing a layer arrangement, said arrangement (10) having a substrate (20) with a main part (21) made of an organic polymer and having at least one functional layer (41, 42) which is connected to the substrate and which comprises a metal binding phase (51, 52) and solid particles (61, 62) fixed in the metal binding phase, wherein the method has the step of connecting the functional layer (41, 42) to the substrate (20).