Polymer Substrate Sensor Manufacturing via Mold Embedding
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Solution Overview
Problem
Conventional silicon wafer manufacturing processes for biosensors are costly and have low wafer area utilization, limiting the competitiveness and efficiency of miniaturized electronic products.
Innovation Solution
A sensor manufacturing method that integrates a chip into a polymer substrate using a mold with a cavity, where a polymer material is solidified to form a substrate, and conductive lines are formed to connect with the chip, allowing for the creation of a microchannel structure for sensing applications, reducing manufacturing costs and improving compatibility with conventional semiconductor processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional silicon wafer manufacturing process is used for biosensors, then manufacturing precision and reliability are improved, but manufacturing cost increases and wafer area utilization rate decreases
Solution Approach 1:
The patent replaces expensive silicon wafers with disposable polymer substrates that can be manufactured at low cost using simple molding processes. The polymer substrates are designed for single-use applications, eliminating the need for expensive silicon wafer fabrication while maintaining sufficient manufacturing precision for biosensor applications
Solution Approach 2:
The patent changes the material parameter from silicon to polymer, and the manufacturing process parameter from semiconductor fabrication to molding and heat treatment. This parameter transformation enables low-cost mass production while achieving adequate manufacturing precision for the intended application
2Manufacturing precision
If conventional silicon wafer manufacturing process is used for biosensors, then manufacturing precision is improved, but wafer area utilization rate decreases
Solution Approach 1:
The patent segments the manufacturing process into separate steps: first forming the polymer substrate in a mold cavity, then embedding individual chips or sensor elements into the substrate. This segmentation allows for flexible arrangement and high utilization of the polymer substrate area, unlike the fixed wafer structure
Solution Approach 2:
The patent transitions from 2D wafer-based manufacturing to 3D embedded structures where chips are positioned within the polymer substrate volume. This dimensional change enables better space utilization and allows multiple sensors to be integrated in a compact three-dimensional arrangement
3Adaptability or versatility
If chip is embedded in polymer substrate using mold cavity, then manufacturing cost is reduced and adaptability is improved, but manufacturing precision may decrease
Solution Approach 1:
The patent performs preliminary actions by pre-forming the polymer substrate in the mold cavity with predetermined geometric features and embedding positions. Chips are then placed into these pre-prepared positions, ensuring consistent positioning precision across multiple devices while maintaining the advantages of low-cost polymer manufacturing
Solution Approach 2:
The patent introduces the polymer substrate as an intermediary medium between the chip and the final device assembly. The substrate provides mechanical support, electrical insulation, and precise positioning features, enabling adaptable chip integration without requiring high-precision semiconductor fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces manufacturing costs, enhances product competitiveness, and allows for the integration of various chips with sensing properties like gas, pressure, or humidity sensing, achieving the benefits of a system in package while maintaining compatibility with existing semiconductor processes.
Implementation Method 1
A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate
Implementation Method 2
the polymer material is solidified to form a polymer substrate
Data Source
AI summary
Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release treatment is performed to isolate the polymer substrate from the cavity. A plurality of conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.