Polymer Support Layer for Wafer-Level Thin Die Processing
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Solution Overview
Problem
Large electronic devices with thin semiconductor wafers face mechanical support issues during processing, as the cumulative thickness of device layers is insufficient, leading to potential damage and the need for complex and costly processing sequences.
Innovation Solution
A process involving the formation of permanently attached polymer support layers on the workpiece, which provides mechanical support, allowing for the removal of significant portions of the base substrate, ensuring the combined thickness of the workpiece and polymer support layer meets or exceeds 30 microns, enabling wafer-level processing without damaging thin device layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cumulative thickness of device layers is kept thin (2-7 microns) for small electronic devices, then manufacturing precision is improved, but mechanical support becomes insufficient leading to potential damage during processing
Solution Approach 1:
A carrier substrate is introduced as an intermediary element between the thin device layers and the processing environment. The carrier substrate provides mechanical support and strength to the thin device layers (2-7 microns thick) during processing, preventing damage while allowing the device layers to maintain their thin profile for manufacturing precision. The carrier substrate acts as a mediator that enables handling and processing of otherwise fragile thin structures.
2Strength
If a complex processing sequence is used to attach and remove substrates for mechanical support, then mechanical support is improved, but device complexity and processing time increase
Solution Approach 1:
The device layers are formed on the carrier substrate before the actual device processing begins. The carrier substrate is prepared in advance with appropriate properties (mechanical strength, thermal conductivity, etc.) to support the thin device layers throughout the processing sequence. This preliminary setup eliminates the need for complex attach and remove operations during processing, as the carrier substrate remains in place providing continuous support.
Solution Approach 2:
The carrier substrate serves multiple functions simultaneously: providing mechanical support, enabling processing access, facilitating thermal management, and supporting the device layers through multiple processing steps. This multi-functional carrier substrate replaces the need for multiple separate substrate attachment and removal operations, simplifying the overall processing sequence while maintaining adequate mechanical support.
Data Source
AI summary
A process can be used to allow processing of thin layers of a workpiece including dies. The workpiece can include a base substrate and a plurality of layers overlying the base substrate. The process can include forming a polymer support layer over the plurality of layers; thinning or removing the base substrate within a component region of the workpiece, wherein the component region includes an electronic device; and singulating the workpiece into a plurality of dies after thinning or removing the base substrate. In another aspect, an electronic device can be formed using such process. In an embodiment, the workpiece may have a size corresponding to a semiconductor wafer to allow wafer-level, as opposed to die-level, processing.