Polymer Surface Polishing for High-Density Integration

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Solution Overview

Problem

The uniformity of polymer surfaces in semiconductor manufacturing processes, such as in interposers, damascene technology, and re-distribution layers, is inadequate for high-density integration and advanced packaging, leading to issues in etching, PVD, electroplating, and multi-layer processes, and is currently addressed by costly and complex methods like CVD and CMP with limited improvement.

Innovation Solution

A method involving curing the polymer surface followed by a Chemical Mechanical Polishing (CMP) process using specific colloidal slurries and polishing pads to achieve a uniformity of less than 1%, improving the surface's hydrolysis efficiency and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymer is used to form a dielectric layer, then cost is reduced and process is simplified, but surface uniformity deteriorates to around +/−10%

Engineering Contradiction:

Improvemanufacturing cost and process complexityVSAvoidsurface uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies a preliminary surface treatment process to the polymer dielectric layer before subsequent manufacturing steps. This includes plasma treatment or chemical etching to modify the surface properties, creating a more uniform surface that meets the requirements for high-density integration while maintaining the cost advantages of using polymer materials.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the surface parameters of the polymer dielectric layer through controlled chemical or physical processes. By adjusting surface energy, roughness, and composition through treatments like plasma oxidation or controlled etching, the surface uniformity is improved from +/−10% to meet the stricter requirements for advanced packaging and high-density integration.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If CVD process is used to deposit SiO2 dielectric layer on polymer substrate, then surface uniformity is improved, but manufacturing cost increases and process complexity increases

Engineering Contradiction:

Improvesurface uniformityVSAvoidmanufacturing cost and process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the expensive and complex CVD process with a simpler, more cost-effective surface treatment approach. Instead of depositing an entire SiO2 dielectric layer through costly CVD equipment and processes, the invention uses affordable surface modification techniques like plasma treatment or chemical etching that achieve the required surface uniformity without the high costs and complexity of CVD.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent extracts only the essential function needed from the CVD process - surface uniformity improvement - and achieves it through a simpler method. Rather than using the full CVD process to deposit a dielectric layer, the invention applies a targeted surface treatment that accomplishes the same surface uniformity goal without the unnecessary complexity and cost of material deposition.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If polymer outer dielectric layer is used in RDL process, then cost is reduced and process is simplified, but surface uniformity deteriorates with increasing RDL layers

Engineering Contradiction:

Improvemanufacturing cost and process simplicityVSAvoidsurface uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies surface treatment processes to each polymer outer dielectric layer before subsequent RDL fabrication. This preliminary action prevents cumulative surface uniformity deterioration by resetting the surface quality at each layer, enabling successful implementation of more than 3 RDL layers while maintaining both cost efficiency and surface uniformity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method significantly improves the uniformity of polymer surfaces to meet high-density integration requirements, reduces costs by replacing silicon substrates with polymer, and enhances CMP rates, allowing for successful implementation of multiple RDL layers and small linewidth integration.

Implementation Method 1

polishing the polymer surface cured through a CMP process

Methodology Applied

Scientific EffectAbrasion: Abrasion

Implementation Method 2

curing the polymer surface

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS9589786B2Method for polishing a polymer surface

Publication Date: 2017.03.07 NAT CENT FOR ADVANCED PACKAGING CO LTD

AI summary

A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to <1% through a CMP process, which can meet the requirements of high density and small linewidth integration.