Water-Soluble Polymer Surface Treatment Composition for Semiconductor Substrates
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Solution Overview
Problem
Current cleaning compositions for semiconductor substrates after chemical mechanical polishing (CMP) are inadequate in removing residues, leading to potential contamination and reliability issues in semiconductor devices.
Innovation Solution
A surface treatment composition containing a water-soluble polymer with an adsorption amount of 100 ng/cm2 to 600 ng/cm2 on a quartz crystal microbalance electrode, which effectively prevents re-adhesion of residues and ensures their removal without leaving a polymer residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning composition containing polycarboxylic acid or hydroxycarboxylic acid and surfactants is used, then foreign matter can be removed without corroding the substrate surface, but residues cannot be sufficiently removed from the polished object
Solution Approach 1:
The patent changes the chemical composition parameters by introducing a water-soluble polymer with specific molecular weight (1,000-1,000,000) and specific chemical structure (polyvinyl alcohol, polyacrylic acid, or polyacrylamide) at controlled concentrations (0.01-1%). This parameter change enables sufficient residue removal while maintaining substrate surface integrity, resolving the contradiction between cleaning effectiveness and surface protection.
Solution Approach 2:
The patent creates a composite cleaning composition that combines traditional cleaning agents (polycarboxylic acid, hydroxycarboxylic acid, surfactants) with a water-soluble polymer. This composite formulation synergistically enhances residue removal capability while the water-soluble polymer prevents excessive corrosion, simultaneously achieving both improved cleaning efficiency and surface protection.
2Reliability
If a cleaning composition is introduced to remove impurities from the semiconductor substrate surface, then electrical properties and device reliability can be maintained, but the cleaning process becomes more complex
Solution Approach 1:
The water-soluble polymer in the cleaning composition performs multiple functions simultaneously: it acts as a cleaning agent that removes residues, a surface protector that prevents corrosion, and a residue-prevention agent that avoids leaving polymer deposits. This multi-functionality simplifies the overall cleaning process while maintaining device reliability, eliminating the need for multiple separate treatment steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition efficiently removes residues from semiconductor substrates, enhancing the reliability and cleanliness of the surface, thereby improving the performance and longevity of semiconductor devices.
Implementation Method 1
an adsorption amount of the water-soluble polymer adsorbed to a quartz crystal microbalance electrode is 100 ng/cm2 or more and 600 ng/cm2 or less per unit area of the quartz crystal microbalance electrode
Data Source
AI summary
Provided is a means capable of sufficiently removing residues remaining on a surface of a polished object. Provided is a composition for surface treatment for use in reducing a residue on a surface of a polished object, containing a solvent and a water-soluble polymer, wherein an adsorption amount of the water-soluble polymer adsorbed to a quartz crystal microbalance electrode is 100 ng/cm2 or more and 600 ng/cm2 or less per unit area of the quartz crystal microbalance electrode.