Conductive Polymer Via Compensation Layer
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Solution Overview
Problem
In modern integrated circuits, pattern placement errors due to off-axis illumination in extreme ultraviolet light lithography lead to misalignment of interconnect lines, compromising device performance by reducing the available floor space and increasing the risk of shorting between conductive features.
Innovation Solution
A pattern placement error compensation layer is formed using a conductive polymer layer with a conductive path length less than the spacing between conductive features, which is integrated into the semiconductor device to mitigate misalignment by providing a path for current flow and lowering net contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If off-axis illumination is used in EUVL for patterning vias, then lithography capability is improved, but pattern placement error occurs causing misalignment between vias and underlying features
Solution Approach 1:
A conductive polymer layer is introduced as an intermediary between the via opening and the underlying conductive feature. This layer acts as a mediator that compensates for pattern placement errors by providing a compliant interface that can accommodate misalignment while maintaining electrical connection, thus resolving the contradiction between improved lithography capability and degraded pattern placement accuracy
Solution Approach 2:
The conductive polymer layer changes the electrical parameter of contact resistance by providing a low-resistance path that compensates for misalignment. By modifying the contact interface properties through this intermediate layer, the system maintains reliable electrical connection despite pattern placement errors introduced by off-axis illumination
2Reliability
If the conductive polymer layer has a conductive path length less than the spacing between conductive features, then electrical isolation between features is maintained, but contact resistance must be sufficiently low to ensure reliable connections
Solution Approach 1:
The conductive polymer layer exhibits local quality by having different electrical properties in different regions: it provides low contact resistance where it contacts the conductive feature for reliable connection, while maintaining sufficient electrical isolation where the conductive path length is limited to prevent shorting between adjacent features. This spatial variation in electrical properties resolves the contradiction between reliable contact and electrical isolation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive polymer layer effectively reduces the impact of pattern placement errors by maintaining electrical isolation between conductive features and reducing contact resistance, thereby enhancing device performance and reliability.
Implementation Method 1
The conductive polymer layer has a conductive path length. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.
Data Source
AI summary
A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.