Polymer Via Plugs Preventing Solder Diffusion in Semiconductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During semiconductor fabrication, solder can diffuse into and through metallization structures, damaging semiconductor devices due to its ability to wick into vias and cause electrical connections to fail.
Innovation Solution
The use of polymer via plugs, such as polyimide, is introduced to fill the vias, which can withstand soldering and operating temperatures, preventing solder from diffusing into the metallization structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to create electrical connections, then electrical and mechanical connections are facilitated, but solder may wick into vias and diffuse through metallization structures causing damage
Solution Approach 1:
A polymer material is introduced as an intermediary substance within the vias to prevent direct contact between the solder and the metallization structures. The polymer acts as a barrier layer that blocks solder diffusion while allowing the soldering process to proceed normally on the surface, thus protecting the internal structures from harmful solder penetration.
Solution Approach 2:
The polymer is applied to the vias before the soldering process occurs, creating a preventive barrier in advance. This preliminary action prevents the harmful effect of solder wicking and diffusion before it can occur, rather than attempting to address the problem after damage has happened.
2Object-affected harmful factors
If polymer via plugs are used to prevent solder diffusion, then solder protection is improved, but the device complexity increases
Solution Approach 1:
The polymer material undergoes a parameter change from liquid to solid state through curing, transforming from an easy-to-apply liquid form during the filling process to a stable solid barrier that provides effective solder protection. This phase transition simplifies the overall process by using a material that can be easily applied but then becomes a robust protective structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer via plugs effectively prevent solder from entering the vias during soldering processes, thereby protecting the semiconductor devices from damage and ensuring reliable electrical connections.
Implementation Method 1
providing a polymer in liquid form over a second surface in a vacuum such that the polymer in liquid form flows into the at least one via
Implementation Method 2
curing the polymer to form a solidified via plug
Data Source
AI summary
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.