Conductive Polymer Wire Bonding via Mechanical Deformation
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Solution Overview
Problem
Existing connection units for electrically conducting polymer coated wires and conducting substrates suffer from poor electronic and mechanical properties, requiring complex and energy-consuming production processes, which limits their use and reliability, especially in medical devices.
Innovation Solution
A connection unit comprising a substrate with an insulating layer and conducting regions, a conducting wire with a thick organic outer layer, and positioning wires, where the wire's outer layer is deformed to establish electrical contact without damaging it, using a method that reduces production time, complexity, and energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering, welding or the like is used to electrically connect the conducting wire with the substrate, then electrical connection is achieved, but the production process becomes complex and energy-consuming, and the electronic and mechanical properties deteriorate
Solution Approach 1:
The patent extracts and eliminates the need for soldering, welding, or brazing processes by using a mechanical pressing method instead. The conducting wire is directly pressed against the substrate to establish electrical contact, removing the complex thermal processing steps and associated curing operations that characterize traditional joining methods.
Solution Approach 2:
The patent replaces thermal-mechanical systems (soldering, welding, brazing that require heating and subsequent curing) with a purely mechanical pressing system. A pressing device applies force to deform the insulation layer and establish electrical contact, substituting complex thermal processes with a simpler mechanical operation.
2Reliability
If soldering, welding or the like is used to electrically connect the conducting wire with the substrate, then electrical connection is achieved, but energy consumption increases due to required curing steps
Solution Approach 1:
The patent extracts and eliminates the energy-intensive curing steps associated with soldering, welding, and brazing processes. By using direct mechanical pressing to establish electrical contact, the method removes the need for prolonged heating and curing operations that consume significant energy in traditional production methods.
Solution Approach 2:
The patent replaces thermal energy-intensive processes with a mechanical pressing operation. Instead of using heat to melt, bond, and cure materials, the system uses mechanical force to deform the insulation layer and create electrical contact, dramatically reducing energy consumption during the connection process.
3Reliability
If the outer layer of the conducting wire is removed or damaged to achieve electrical contact, then electrical conductivity improves, but the wire's durability and reliability deteriorate
Solution Approach 1:
Instead of removing or damaging the outer insulation layer to expose the conductor (traditional approach), the patent inverts the approach by deforming the insulation layer itself to create conductive contact. The insulation layer is pressed and deformed to establish electrical connection while remaining intact, preserving the wire's protective coating and durability.
Solution Approach 2:
The patent employs a composite structure where the insulation layer contains conductive particles or conductive polymer material. This allows the outer layer to maintain its insulating function while also providing electrical conductivity when deformed, eliminating the need to compromise the protective coating for electrical contact.
4Reliability
If complex production operations are undertaken to improve electronic and mechanical properties, then connection quality improves, but production time and complexity increase
Solution Approach 1:
The patent segments the connection process into a single integrated pressing operation that simultaneously achieves mechanical contact, electrical connection, and insulation deformation. This eliminates the need for sequential operations such as heating, bonding, and curing that characterize traditional methods, thereby improving production efficiency while maintaining connection quality.
Solution Approach 2:
The patent merges multiple production operations (heating, bonding, curing) into a single mechanical pressing step. By combining these functions into one operation, the method reduces production time and complexity while achieving the same connection quality, thereby improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electrical conductivity, durability, and reliability of the connection units, improving their performance in medical devices by simplifying the production process and reducing material usage.
Implementation Method 1
the outer layer is deformed, and the conducting wire is in electrical contact with, as well as touching, the substrate and the positioning wire
Data Source
AI summary
In general, the present invention relates to electrically conducting, polymer coated wires that are in electric contact with, as well as touching, electrically conducting substrates. In particular, the present invention relates to a connection unit for achieving the aforementioned electric connection and touching, as well as a method for producing said connection unit. The present invention also relates to a use for such a connection unit.