Inert Polymer Wirebond Removal for Quantum Hardware
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Solution Overview
Problem
Current methods for removing wirebonds from quantum hardware are time-consuming, risk damage to the device, and often leave debris or residue, due to manual removal using tweezers.
Innovation Solution
A method involving the deposition of an inert polymer layer on the quantum hardware surface to mechanically bond with the wirebonds, followed by curing and subsequent removal of the layer and wirebonds, ensuring efficient and secure detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual removal using tweezers is used, then wirebonds can be removed, but the process is time-consuming and labor-intensive
Solution Approach 1:
The patent extracts the wirebond removal process from manual manipulation and transforms it into a material-based removal system. A polymer layer is deposited that selectively bonds to wirebonds, allowing them to be lifted off together as a unit, dramatically increasing removal speed and productivity
Solution Approach 2:
The patent introduces a polymer layer as an intermediary substance between the removal tool and the wirebonds. This polymer layer selectively adheres to the wirebonds and facilitates their collective removal, solving the inefficiency of manual tweezers while protecting the quantum hardware surface
2Productivity
If manual removal using tweezers is used, then wirebonds can be removed, but damage to the quantum hardware is risked
Solution Approach 1:
The patent applies a polymer layer beforehand that acts as a cushioning medium. This layer selectively bonds to wirebonds and provides a controlled removal mechanism, preventing direct contact between removal tools and the fragile quantum hardware, thus protecting device integrity
Solution Approach 2:
The polymer layer serves as an intermediary that mediates the removal process. It selectively adheres to wirebonds through mechanical interlocking while its inert nature and controlled properties prevent damage to the underlying quantum hardware, ensuring reliable removal without compromising device integrity
3Productivity
If manual removal using tweezers is used, then wirebonds can be removed, but debris or residue is left on the surface
Solution Approach 1:
The patent employs a disposable polymer layer that is deposited, used for removal, and then discarded along with the wirebonds. This single-use approach ensures that no persistent residue remains on the quantum hardware surface, maintaining manufacturing precision and surface cleanliness
Solution Approach 2:
The patent extracts both the wirebonds and the polymer layer together in a single removal operation. The polymer layer is designed to be removed completely along with the wirebonds, ensuring no debris or residue is left on the quantum hardware surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a more efficient and safer removal of wirebonds without damaging the quantum hardware, reducing the risk of residue and improving the cleanliness of the surface.
Implementation Method 1
bonding the set of wirebonds mechanically to the first layer
Implementation Method 2
followed by curing and subsequent removal of the layer and wirebonds
Data Source
AI summary
A product causes a method to be performed, the method includes depositing a first layer on a portion of a first surface of a quantum hardware, the portion of the first surface comprising a set of wirebonds. The method further includes coupling the set of wirebonds to the first layer. The method further includes removing the first layer and the set of wirebonds from the first surface of the quantum hardware. In an embodiment, the first layer is an inert polymer in solution.