Polymeric Foil Patch-Clamp Array with Release Portions

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Solution Overview

Problem

The manufacturing of polymeric cell-capture chips for patch clamp measurements is hindered by the mechanical properties of polymeric materials, which are not suited to existing manufacturing processes, and achieving a high surface smoothness for giga-seal formation is challenging, leading to time-consuming and expensive production methods.

Innovation Solution

A method using macro-dimensional techniques and devices to manipulate nano-dimensional articles, involving a polymeric foil with a regular array of patch portions, a grid portion, and release portions, where the foil is overlaid on a substrate with through-holes and sealed, allowing the grid portion to be removed, creating a microfluidic cell-capture chip with a continuous seal and tags around each patch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymeric materials are used to fabricate disposable chips, then manufacturing cost is reduced and disposability is enabled, but the mechanical properties are not suited to existing manufacturing processes and surface smoothness is insufficient for giga-seal formation

Engineering Contradiction:
Improvemanufacturing costVSAvoidsurface smoothness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The polymeric foil is divided into multiple patch portions arranged in a regular array, each capable of forming a seal around a through-hole. This segmentation allows individual patches to be optimized for sealing while the overall structure maintains manufacturability through standardized repetition of units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The foil incorporates a grid portion with different mechanical properties than the patch portions. The grid portion provides structural support and facilitates handling, while the patch portions are optimized for sealing. This local differentiation allows each region to serve its specific function optimally.

Inventive Principle:
Principle #3Local quality

2Reliability

If traditional manufacturing techniques are used for polymeric chips, then quality and cleanliness requirements are met, but production is time-consuming and expensive

Engineering Contradiction:
ImprovequalityVSAvoidproduction speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Multiple patches are pre-formed on a single polymeric foil in a regular array pattern before being transferred to the substrate. This preliminary arrangement allows for batch processing and reduces the number of individual operations required, thereby increasing productivity while maintaining quality through pre-controlled formation processes.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If a continuous polymeric foil is used to cover multiple through-holes, then manufacturing is simplified, but removal of excess material is difficult without damaging the sealed patches

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidpatch integrity
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

Release portions are pre-formed as tensile weakness lines connecting the patch portions to the grid portion. These pre-defined weakness lines ensure that when the grid portion is removed, the release portions rupture in a controlled manner, releasing individual patches intact without requiring forceful removal that could damage the seals.

Inventive Principle:
Principle #10Preliminary action

4Strength

If the foil is made with high tensile strength for durability, then mechanical robustness is improved, but the release portions cannot rupture easily to free the patches

Engineering Contradiction:
Improvefoil durabilityVSAvoidpatch release
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The foil structure differentiates between the patch portions and grid portion through the release portions, which have deliberately reduced tensile strength compared to the surrounding areas. This local weakness allows the release portions to rupture preferentially under tensile stress, enabling easy separation of patches from the grid while the rest of the foil maintains its structural integrity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3110552B1Integrated polymer foil, patch-clamp array and membane valves
Publication Date: 2019.07.24 SOPHION BIOSCIENCE AS
  • EP3110552B1 patent drawingFigure 1
  • EP3110552B1 patent drawingFigure 2
  • EP3110552B1 patent drawingFigure 3A~3H

AI summary

The invention describes a foil of polymeric material comprising a plurality of patch portions and a grid portion arranged between said patches. Each patch portion is connected to the grid portion by means of one or more connecting elements. Each patch portion is separated from the grid portion in the X-Y plane by means of a release portion, said release portion having a tensile strength in the X-Y plane which is lower than the tensile strength of both said patch portions and said grid portion, such that - upon exertion of a tensile force between said patch portions and said grid portion - said foil ruptures preferentially at said release portion. The invention relates to a method for the production of cell-capture chips using said foil, and a cell capture chip produced by said method.