Polymeric Substrate LED Illumination Assembly Thermal Management
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Solution Overview
Problem
Existing solid-state lighting technologies face challenges in accommodating complex three-dimensional form factors while effectively managing thermal, electrical, and mechanical considerations, particularly due to limitations in component density and heat dissipation in LED applications.
Innovation Solution
The integration of a polymeric substrate with embedded and printed conductors and a heat spreader provides a solution for thermal energy management in solid-state lighting assemblies, allowing for advanced electronic functionality and high power levels without overheating, by supporting LEDs and dissipating heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a printed circuit board is used for component assembly, then electrical connectivity is achieved, but thermal management and three-dimensional form factor accommodation are limited
Solution Approach 1:
The patent transitions from traditional two-dimensional PCB mounting to three-dimensional component arrangement. The LED package is positioned above the substrate surface, and the heat spreader extends vertically to engage with the LED's thermal path, enabling effective heat dissipation in the Z-direction while accommodating complex 3D form factors.
Solution Approach 2:
The polymeric substrate serves multiple functions simultaneously: it provides mechanical support for the LED package, acts as an electrical insulator, facilitates thermal conduction to the heat spreader, and enables three-dimensional component placement. This multi-functionality resolves the contradiction by integrating electrical and thermal management capabilities within a single structural platform.
2Productivity
If component density is increased on a PCB, then electrical functionality is enhanced, but thermal dissipation becomes more difficult
Solution Approach 1:
The heat spreader is positioned locally beneath the LED package, concentrating thermal management resources where heat generation is highest. This localized approach allows high component density in specific areas while maintaining effective heat dissipation at the LED junction, resolving the contradiction between density and thermal management.
3Power
If LEDs are designed for high power levels, then illumination output is improved, but thermal management requirements increase
Solution Approach 1:
The heat spreader acts as a thermal intermediary between the LED package and the surrounding environment. It conducts heat away from the LED junction through its thermally conductive material (such as metal or thermally conductive polymer), enabling high power LEDs to operate at elevated power levels while maintaining safe operating temperatures through efficient heat transfer to the ambient environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of illumination assemblies with improved heat management, enabling more complex and higher power LED designs that can be molded into desired three-dimensional shapes, enhancing both functionality and form factor while reducing material costs.
Implementation Method 1
a heat spreader supported by the substrate and thermally coupled to the LED
Data Source
AI summary
An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.