Polymeric Resin Copolymerization for Low Dielectric Loss

The patent employs a composite material system consisting of polymeric resin combined with specific inorganic fillers (such as silica, alumina, or boron nitride) to achieve both good mechanical properties and excellent dielectric properties. The resin matrix provides structural integrity and adhesion, while the inorganic filler particles contribute to low relative permittivity and low loss tangent at high frequencies, resolving the contradiction between mechanical strength and dielectric performance.

The patent uses a composite formulation where the polymeric resin provides adhesion to copper substrates through functional groups in its structure, while inorganic fillers with inherent low dielectric loss characteristics (such as boron nitride or silica) are incorporated to maintain low loss tangent at high frequencies. This composite approach allows simultaneous achievement of good adhesion and excellent high-frequency dielectric performance.

The patent formulates a composite material where inorganic fillers with low dielectric constants (such as silica or alumina) are dispersed in a polymeric resin matrix that provides good mechanical properties including tensile elongation. The resin matrix acts as a binding phase that maintains the structural flexibility and ductility, while the inorganic filler particles contribute to low relative permittivity, thus resolving the contradiction between dielectric performance and mechanical elongation.

The patent employs a composite system where inorganic fillers with inherently low dielectric loss (such as boron nitride or silica) are combined with a polymeric resin that contains adhesion-promoting functional groups. The resin phase ensures good bonding to copper substrates through chemical or physical adhesion mechanisms, while the inorganic filler phase maintains low loss tangent at high frequencies, thereby resolving the contradiction between adhesion and dielectric loss.