Polymeric Vertical Waveguide for High-Density Optical Packaging

Solution Overview

Problem

Glass optical fibers are unsuitable for complex high-density circuitry due to their high cost, poor durability, and high fabrication costs, necessitating the development of cost-effective, reliable polymeric materials for integrated optical and optoelectronic devices.

Innovation Solution

A semiconductor device structure incorporating a substrate with a passivation layer, redistribution layers, a bonding structure, a vertical waveguide, and a lens cap for efficient optical data transmission, utilizing polymeric materials to form a light coupling device that allows for flexible placement of components and reduces fabrication costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If glass optical fibers are used for high-speed data transfer, then transmission speed is improved, but cost and fabrication complexity increase

Engineering Contradiction:

Improvetransmission speedVSAvoidfabrication cost

Core Design Contradiction:

SpeedVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter from glass to polymer, creating optical waveguides with different refractive indices through material composition changes rather than structural changes. This allows high-speed optical data transfer while reducing fabrication cost and improving flexibility for complex circuitry

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite polymeric materials with different refractive indices to create the optical waveguide structure. The core layer has a higher refractive index than the cladding layer, forming a composite structure that guides light while being more manufacturable than glass optical fibers

Inventive Principle:

Principle #40Composite materials

2Duration of action of moving object

If glass optical fibers are used for long-distance data transfer, then transmission distance is improved, but durability and cost worsen

Engineering Contradiction:

Improvetransmission distanceVSAvoiddurability

Core Design Contradiction:

Duration of action of moving objectVSReliability

Solution Approach 1:

The patent changes the material parameter from glass to polymer, creating optical waveguides with different refractive indices through material composition changes rather than structural changes. This allows high-speed optical data transfer while reducing fabrication cost and improving flexibility for complex circuitry

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite polymeric materials with different refractive indices to create the optical waveguide structure. The core layer has a higher refractive index than the cladding layer, forming a composite structure that guides light while being more manufacturable than glass optical fibers

Inventive Principle:

Principle #40Composite materials

3Quantity of substance

If complex high-density circuitry is implemented with glass optical fibers, then data capacity is improved, but fabrication complexity and cost increase

Engineering Contradiction:

Improvedata capacityVSAvoidfabrication complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent changes the material parameter from glass to polymer, creating optical waveguides with different refractive indices through material composition changes rather than structural changes. This allows high-speed optical data transfer while reducing fabrication cost and improving flexibility for complex circuitry

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite polymeric materials with different refractive indices to create the optical waveguide structure. The core layer has a higher refractive index than the cladding layer, forming a composite structure that guides light while being more manufacturable than glass optical fibers

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient data transfer with increased packaging density and reduced costs, allowing for wafer-level packaging and smaller package sizes without the need for through-substrate vias or special cladding, while maintaining reliability and durability.

Implementation Method 1

a vertical waveguide on a top surface of the optical device

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

a lens cap on a first side of the second substrate, the first side being opposite the second side, the lens cap being aligned with the vertical waveguide

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS10527788B2Package structure and methods of forming same

Publication Date: 2020.01.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.