Polymerizable Composition Infrared Blocking Solder Resist
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Solution Overview
Problem
Current solder resist compositions fail to provide a high light-blocking effect in the infrared region while maintaining transparency in the visible region, and they often require multiple processing steps, which complicates the manufacturing process and increases costs.
Innovation Solution
A polymerizable composition comprising a polymerization initiator, a polymerizable compound, a tungsten compound represented by the formula M x W y O z, and an alkali-soluble binder, along with a filler such as spherical silica treated with a silane coupling agent, is used to form a solder resist that achieves high light-blocking in the infrared and high transparency in the visible region, enabling excellent pattern formation and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional solder resist composition is used, then the manufacturing process is simple, but the light-blocking effect in the infrared region is insufficient
Solution Approach 1:
The patent uses a composite material approach by combining a specific tungsten compound (MxWyOz) with a photopolymerizable binder and filler. This composite formulation enables the solder resist to achieve high infrared light-blocking effect while maintaining visible light transparency and photolithography performance, eliminating the need for separate infrared-blocking layers and reducing processing steps.
Solution Approach 2:
The patent changes the chemical composition parameters by using a specific tungsten compound with defined stoichiometry (MxWyOz where 0.001≤x/y≤1.1 and 2.2≤z/y≤3.0) and controlling the content within 1-20 mass%. This parameter optimization enables simultaneous achievement of infrared absorption, visible light transparency, and photopolymerization performance in a single layer.
2Reliability
If an infrared-blocking layer is added separately, then the infrared light-blocking effect is improved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent merges the infrared-blocking function, visible light transparency, and photolithography performance into a single solder resist layer. By incorporating the tungsten compound (MxWyOz) directly into the photopolymerizable composition, the invention eliminates the need for separate infrared-blocking layers and reduces the number of coating and processing steps.
Solution Approach 2:
The patent creates a multi-functional solder resist composition that simultaneously provides infrared absorption, visible light transparency, and photopolymerization capability. The tungsten compound-containing photopolymerizable composition serves multiple functions in a single layer, making the manufacturing process simpler and more cost-effective.
3Reliability
If carbon black is added to ensure infrared light-blocking, then the infrared light-blocking effect is improved, but the visible light transparency and photo-curability deteriorate
Solution Approach 1:
The patent changes the light-absorbing material from carbon black to a specific tungsten compound (MxWyOz) with controlled stoichiometry. This parameter change in the absorbing material enables selective absorption in the infrared region while maintaining transparency in the visible region and compatibility with photopolymerization initiators.
Solution Approach 2:
The patent uses a composite material system combining tungsten compound particles with a photopolymerizable binder. This composite formulation achieves high infrared absorption while maintaining visible light transparency and photo-curability, overcoming the limitations of carbon black-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively blocks infrared light while allowing visible light to pass through, ensuring the alignment marks are detectable and providing the necessary durability and adherence to the substrate, thus simplifying the manufacturing process and reducing costs.
Implementation Method 1
the composition effectively blocks infrared light while allowing visible light to pass through
Implementation Method 2
a polymerizable composition comprising a polymerization initiator, a polymerizable compound
Data Source
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AI summary
A polymerizable composition includes: a polymerization initiator; a polymerizable compound; a tungsten compound; and an alkali-soluble binder.