Polymerized Thermal Interface Material for Uniform Liquid Metal Heat Transfer
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Solution Overview
Problem
Conventional thermal interface materials using liquid metals suffer from poor reliability and homogeneity issues due to insufficient interaction between liquid metal and polymer, leading to depletion at edges and inadequate heat conduction.
Innovation Solution
A copolymerized thermal interface material is developed using surface-modified liquid metal spheres bonded covalently or organometallically to silicon monomers, forming a robust polymer matrix that ensures uniform distribution and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal is loaded into polymer matrix, then thermal conductivity is improved, but homogeneity deteriorates due to depletion at edges
Solution Approach 1:
Silicon monomers act as intermediary substances that bond to liquid metal surfaces, creating a compatible interface between the liquid metal and polymer matrix. This intermediary bonding prevents liquid metal aggregation and ensures uniform distribution throughout the polymer matrix, eliminating edge depletion while maintaining high thermal conductivity.
Solution Approach 2:
The invention changes the chemical parameters of the liquid metal surface by introducing silicon monomer functional groups. This surface modification alters the interaction properties between liquid metal and polymer, transforming the system from one with poor compatibility and heterogeneity to one with improved compatibility and uniform distribution.
2Temperature
If liquid metal is used in thermal interface material, then heat conduction is improved, but reliability deteriorates due to insufficient interaction with polymer
Solution Approach 1:
Silicon monomers serve as chemical intermediaries that form strong bonds with both liquid metal surfaces and polymer matrices. This dual bonding capability creates reliable mechanical and thermal coupling, ensuring the liquid metal remains stably embedded in the polymer matrix under thermal and mechanical stress, thereby improving reliability while maintaining heat conduction.
Solution Approach 2:
The invention creates a composite material system consisting of liquid metal particles, silicon monomer modifiers, and polymer matrix. This composite structure leverages the high thermal conductivity of liquid metal, the bonding capability of silicon monomers, and the structural properties of the polymer, achieving both improved heat conduction and enhanced reliability through synergistic material combination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thermally and mechanically reliable material with enhanced heat extraction capabilities, suitable for high-power IC devices, by overcoming the limitations of conventional liquid metal polymers.
Implementation Method 1
liquid metal spheres bonded covalently or organometallically to silicon monomers
Implementation Method 2
liquid metal spheres bonded covalently or organometallically to silicon monomers
Implementation Method 3
enhanced heat extraction capabilities, suitable for high-power IC devices
Data Source
AI summary
An integrated circuit (IC) package includes a one or more die, a package substrate, a thermal interface material, and a cover. The cover is disposed over or above the one or more die. The thermal interface material includes a surface modified metal and a silicon monomer.