Polynorbornene Photosensitive Compositions for Low-Temperature Curing
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Solution Overview
Problem
Current polymer materials used in microelectronics and optoelectronics, such as polyimide, polybenzoxazole, and benzocyclobutane, require high curing temperatures and special handling conditions, which can be costly and impractical for applications like redistribution layers and direct adhesive bonding, and often lack suitable thermal stability, mechanical strength, and dissolution rate properties.
Innovation Solution
Development of self-imageable polynorbornene compositions with specific additives that allow for curing at temperatures of 200°C or lower, providing improved thermal stability, mechanical strength, and tailored properties like stress, modulus, and water vapor permeability, while also enhancing dissolution rate and photosensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If polyimide, polybenzoxazole, or benzocyclobutane compositions are used to achieve thermal stability and mechanical strength, then thermal stability and mechanical strength are improved, but curing temperatures must be in excess of 250°C which increases process costs and complexity
Solution Approach 1:
The patent changes the chemical composition parameters by using fully formed polymer backbones with specific functional groups that enable curing at lower temperatures (200°C or lower) while maintaining thermal stability equivalent to traditional high-temperature materials
Solution Approach 2:
The patent creates composite material systems combining fully formed polymer backbones with specific additives and functional groups that work together to achieve both low-temperature curability and high thermal stability, replacing single-material solutions
2Stability of the object's composition
If polyimide, polybenzoxazole, or benzocyclobutane compositions are used to achieve thermal stability and mechanical strength, then thermal stability and mechanical strength are improved, but special handling conditions are required to remove by-products and exclude oxygen or water vapor which increases process complexity
Solution Approach 1:
The patent extracts and eliminates the problematic by-product formation step by using fully formed polymer backbones that do not require chemical transformation during curing, removing the need for special handling to exclude oxygen and water vapor
Solution Approach 2:
The polymer backbone is pre-formed before the curing process, so that the structural formation occurs during polymerization rather than during curing, eliminating the need for complex by-product removal procedures
3Stability of the object's composition
If current polymer materials are used to provide thermal stability and mechanical strength, then thermal stability and mechanical strength are improved, but dissolution rate properties are insufficient which limits resolution and photospeed
Solution Approach 1:
The patent introduces local functional groups and additives at specific locations within the polymer structure that enhance dissolution rate and photosensitivity without compromising the overall thermal stability provided by the polymer backbone
Solution Approach 2:
The patent modifies chemical composition parameters by incorporating specific functional groups and additives that change the dissolution characteristics and photosensitivity of the material while maintaining thermal stability
4Stability of the object's composition
If polyimide, polybenzoxazole, or benzocyclobutane compositions are used to achieve thermal stability, then thermal stability is improved, but the fully formed polymer backbone is not present which requires curing to form the backbone structure
Solution Approach 1:
The polymer backbone is pre-formed during polymerization before the curing step, so that curing only needs to activate functional groups rather than form the backbone structure, significantly simplifying the curing process
Solution Approach 2:
The patent separates the backbone formation process (occurring during polymerization) from the functional group activation process (occurring during curing), allowing each process to be optimized independently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polynorbornene compositions enable the formation of high-quality films and layers suitable for various microelectronic and optoelectronic applications, including interlevel dielectrics, redistribution layers, and adhesive bonding, with improved thermal and opto-electronic properties, reduced processing costs, and enhanced integration into process steps.
Implementation Method 1
a photoactive compound (PAC) and/or photosensitizer wherein the PAC and/or photosensitizer exhibits photolysis upon exposure to a wavelength of actinic radiation
Implementation Method 2
curing at temperatures of 200° C. or lower
Data Source
AI summary
The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.