Polyolefin Hot Melt Adhesive Composition for Low Viscosity and Color Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Hot melt adhesive compositions containing polybutene-1 visbroken with peroxides suffer from unpleasant odor and high yellow index, limiting their use in applications like food packaging due to high viscosity and color issues.
Innovation Solution
A hot melt adhesive composition comprising 28-75 wt.% of a butene-1 copolymer with 0.5-5.0 wt.% comonomer content and 25-72 wt.% of additional components like waxes, resins, or plasticizers, tailored to achieve low viscosity and improved adhesion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If polybutene-1 is visbroken with peroxides to achieve low viscosity, then viscosity is reduced, but unpleasant odor and high yellow index occur
Solution Approach 1:
The patent extracts and eliminates the harmful peroxide degradation pathway by replacing it with an alternative low-viscosity polybutene-1 that does not require peroxide treatment. This removes the source of unpleasant odor and yellowing while maintaining the desired low viscosity property.
Solution Approach 2:
The patent changes the molecular parameters of polybutene-1 by using a specific low-viscosity variant with controlled molecular weight and structure (without peroxide degradation). This parameter change achieves the desired viscosity reduction while avoiding the harmful chemical modifications that cause odor and discoloration.
2Force
If ex-reactor low molecular weight polyolefins are used to achieve low viscosity, then viscosity is reduced, but color stability deteriorates
Solution Approach 1:
The patent creates a composite adhesive formulation combining low-viscosity polybutene-1 with specific resins and waxes. This composite approach maintains color stability through the stabilizing effect of the resin components while achieving the required low viscosity for adhesive application.
Data Source
AI summary
A polyolefin-based hot melt adhesive composition made from or containing:(A) 28-75 wt. % of a copolymer of butene-1 with Melt Flow Rate values, measured according to ISO 1133 (190° C., 2.16 kg), from 200 to 1500 g/10 min.; and(B) 25-72 wt. % of at least one additional component selected from the group consisting of waxes, resins, plasticizers, additional polymers and mixtures thereof,wherein the amounts of A) and B) are referred to the total weight of A)+B).