Modified Polyolefin Resin Blend for Heat-Resistant Adhesion Stability
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Solution Overview
Problem
Modified polyolefin resins with high heat-resistant adhesivity to difficult-to-adhere base materials suffer from poor solution stability and handling properties.
Innovation Solution
A resin composition comprising a modified polyolefin resin (A) with a melting point of 100°C or lower and a modified polyolefin resin (B) with an extrapolated melting initiation temperature of 120°C or higher, dispersed in resin (A), where resin (B) has an average particle diameter of 0.1 to 100 µm, and modified with α,β-unsaturated carboxylic acid or its derivative, with a mass ratio of (A) to (B) ranging from 50:50 to 95:5.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If modified polyolefin resins with high melting points are used to achieve heat-resistant adhesivity, then heat-resistant adhesivity is improved, but solution stability deteriorates
Solution Approach 1:
The invention divides the modified polyolefin resin into two distinct components: resin (A) with melting point ≤100°C and resin (B) with extrapolated melting initiation temperature ≥120°C. This segmentation allows each component to fulfill different functional requirements - resin (A) provides solution stability while resin (B) contributes heat-resistant adhesivity, thereby resolving the contradiction between these two properties.
Solution Approach 2:
The invention creates a composite resin system by combining two modified polyolefin resins with different thermal characteristics. The composite structure leverages the complementary properties of both resins: the low-melting resin (A) ensures good solution stability and handling, while the high-melting resin (B) provides the necessary heat-resistant adhesivity, thus overcoming the limitations of using a single high-melting resin.
2Temperature
If modified polyolefin resins with high melting points are used to achieve heat-resistant adhesivity, then heat-resistant adhesivity is improved, but handling properties deteriorate
Solution Approach 1:
By segmenting the resin system into two components with distinct melting points, the invention assigns different operational roles to each component. Resin (A) with melting point ≤100°C handles the processing and application stages, providing ease of handling, while resin (B) with extrapolated melting initiation temperature ≥120°C takes over to provide heat-resistant adhesivity after application, thus resolving the contradiction between handling properties and heat-resistant adhesivity.
Solution Approach 2:
The invention utilizes parameter changes in the thermal properties of the resin components. By selecting resin (A) with melting point ≤100°C for processing conditions and resin (B) with extrapolated melting initiation temperature ≥120°C for service conditions, the system adapts its properties across different temperature ranges, enabling easy handling during application while maintaining heat-resistant adhesivity in service.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition exhibits excellent heat-resistant adhesivity to difficult-to-adhere base materials and improved solution stability.
Implementation Method 1
modified polyolefin resins modified with an α,β-unsaturated carboxylic acid or derivative thereof having high adhesion properties are used as adhesion additives to bond difficult-to-bond paints to polyolefin resins
Implementation Method 2
a melting point of 100°C or lower as measured using a differential scanning calorimeter at a temperature increase rate of 10°C/min
Implementation Method 3
measured using a differential scanning calorimeter at a temperature increase rate of 10°C/min in accordance with JIS K7121-1987
Data Source
AI summary
A resin composition contains: a modified product of a polyolefin resin (A) having a melting point of 100°C or lower, the polyolefin resin (A) being modified with at least one compound selected from the group consisting of α,β-unsaturated carboxylic acid and derivative thereof; and a modified product of a polyolefin resin (B) having an extrapolated melting initiation temperature (Tim) of 120°C or higher, the polyolefin resin (B) being modified with at least one compound selected from the group consisting of α,β-unsaturated carboxylic acid and derivative of the α,β-unsaturated carboxylic acid, where the modified product of the resin (B) is dispersed in the modified product of the resin (A) and the average particle diameter of the modified product of the resin (B) is in a range of from 0.1 to 100 µm.