Polyoxyalkylene Polyacrylate Thermal Interface Material
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Solution Overview
Problem
Liquid thermally conductive greases often experience dripping or pump-out phenomena due to member deformation, leading to voids and increased heat resistance, and existing solid forms may not provide sufficient elongation and heat resistance for electronic components.
Innovation Solution
A composition containing a compound with a polyoxyalkylene chain and a poly(meth)acrylate chain, which, when cured, exhibits excellent elongation and heat resistance, and can be formulated with a thermally conductive filler and coupling agent to enhance thermal conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid thermally conductive grease is used, then thermal conductivity is improved, but dripping or pump-out phenomenon occurs leading to void formation and increased heat resistance
Solution Approach 1:
The invention uses polymerizable compounds that undergo phase transition from liquid to solid through curing. The composition is applied in liquid form for easy filling, then cured to form a solid gel that maintains thermal contact without dripping or pumping out, eliminating void formation while preserving thermal conductivity.
Solution Approach 2:
The invention creates a composite material system combining polymerizable compounds (for structural integrity), thermally conductive fillers (for heat dissipation), and curing agents (for crosslinking). This composite approach achieves both the fluidity needed for application and the solidity needed to prevent pump-out phenomenon.
2Reliability
If solid form thermally conductive material is used to suppress dripping, then adhesiveness is improved, but elongation and heat resistance are insufficient
Solution Approach 1:
The invention changes the molecular structure parameters of the polymerizable compounds by selecting specific compounds with polyoxyalkylene chains and poly(meth)acrylate chains. These structural parameters enable the cured product to achieve both high elongation (50% or more) and high heat resistance (glass transition temperature of 100°C or more) simultaneously.
Solution Approach 2:
The invention uses composite material composition with specific polymerizable compounds that combine flexible polyoxyalkylene chains with rigid poly(meth)acrylate chains. This molecular-level composite structure provides both elasticity for elongation and thermal stability for heat resistance.
3Adaptability or versatility
If polymerizable compound is selected to achieve elongation, then deformability is improved, but heat resistance deteriorates
Solution Approach 1:
The invention employs a composite molecular structure combining flexible polyoxyalkylene segments (providing elongation) with rigid poly(meth)acrylate segments (providing heat resistance). The synergistic effect of these composite chains achieves both 50% or more elongation and 100°C or more glass transition temperature.
Solution Approach 2:
The invention applies local quality by having different segments of the polymer chain serve different functions: polyoxyalkylene segments provide flexibility and elongation in specific regions, while poly(meth)acrylate segments provide thermal stability in other regions, achieving both properties in the whole material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product demonstrates improved elongation and heat resistance, preventing void formation and maintaining effective thermal conductivity even under thermal cycling, thus ensuring efficient heat dissipation in electronic components.
Implementation Method 1
a compound having a poly(meth)acrylate chain and two (meth)acryloyl groups
Data Source
AI summary
A composition containing a compound represented by the following Formula (1):[in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; anda compound represented by the following Formula (2):[in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a methyl group; and R23 represents a divalent group having a poly(meth)acrylate chain].