Polypeptide Photoresist Composition Without Acid Diffusion
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Solution Overview
Problem
Chemically amplified photoresists used in semiconductor manufacturing face challenges in achieving high-resolution patterns due to acid diffusion, and they can be hazardous to human health and the environment.
Innovation Solution
A polypeptide-based photoresist composition is developed, comprising regions with specific amino acid sequences that form crystalline structures upon exposure to high-energy light, allowing for precise pattern formation without acid diffusion, and using eco-friendly water as a solvent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chemically amplified materials are used for photoresist, then photoresist development can be achieved, but acid diffusion occurs which makes it difficult to achieve fine or high-resolution patterns
Solution Approach 1:
The patent changes the chemical composition parameters by using polypeptide materials with specific amino acid sequences instead of traditional chemically amplified photoresist materials. This parameter change eliminates acid diffusion while maintaining photoresist functionality, thereby achieving high-resolution patterns without the harmful side effects of conventional materials.
Solution Approach 2:
The patent employs composite polypeptide structures comprising multiple amino acid regions (first region with basic amino acids, second region with acidic amino acids, third region with specific amino acids) to create a new material system. This composite structure provides both the necessary photoresist properties and resistance to acid diffusion, resolving the contradiction between developability and pattern precision.
2Productivity
If conventional photoresist materials are used, then patterning can be achieved, but potentially hazardous chemicals are used which are harmful to human health and the environment
Solution Approach 1:
The patent uses biodegradable polypeptide materials that can be easily disposed of and decomposed in the environment, replacing persistent and toxic conventional photoresist materials. These polypeptide-based materials maintain full patterning capability while being environmentally friendly and safe for human health, eliminating the harmful factors associated with traditional photoresists.
Solution Approach 2:
The patent creates an environmentally benign process environment by using water-soluble polypeptide materials that do not require hazardous solvents or generate toxic waste. This inert and safe chemical environment maintains productivity while eliminating toxicity to human health and the environment.
3Manufacturing precision
If high-resolution patterning is pursued, then finer patterns can be formed, but the process becomes more complex and difficult to control
Solution Approach 1:
The patent extracts and eliminates the acid diffusion mechanism from the photoresist system, removing the source of process complexity and control difficulty. By using polypeptide materials that do not undergo acid-catalyzed reactions, the patent simplifies the patterning process while maintaining or improving resolution, making high-precision patterning more controllable and less complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polypeptide composition enables high-resolution pattern formation with reduced line-edge-roughness and line-width-roughness, minimizing exposure to toxic substances and simplifying waste disposal, while maintaining productivity.
Implementation Method 1
comprising regions with specific amino acid sequences that form crystalline structures upon exposure to high-energy light
Implementation Method 2
exposing at least a portion of the photoresist film to high-energy light
Data Source
AI summary
A polypeptide including a region A, a region B, and a region C, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition.