Polyphenylene Ether Resin Copolymer for Low Dielectric Adhesiveness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current resin compositions, including phenoxy resin, offer excellent adhesiveness but lack heat resistance and have high dielectric constants and loss tangents, making them unsuitable for modern electronic devices requiring accelerated signal response, while fluorine-containing polymers provide low dielectric characteristics but poor compatibility and adhesiveness.
Innovation Solution
A random copolymer compound comprising a polyphenylene ether resin with phenolic hydroxy groups, an aliphatic polymer with alcoholic hydroxy groups, and an acid dichloride binder, along with a terminal-modified polymer compound obtained by modifying the copolymer with a compound having an unsaturated double bond, are used to create a resin composition that can be easily formed into films with improved heat resistance, adhesiveness, and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenoxy resin is used to provide excellent adhesiveness, then adhesiveness is improved, but heat resistance deteriorates and dielectric characteristics worsen (high dielectric constant and loss tangent)
Solution Approach 1:
The patent combines polyphenylene ether resin (providing adhesiveness) with fluorinated polymer compound (providing heat resistance and low dielectric characteristics) into a single resin composition. This merging allows the composition to simultaneously achieve excellent adhesiveness, high heat resistance, and superior dielectric properties that neither component could achieve alone.
Solution Approach 2:
The invention creates a composite resin material consisting of multiple components: polyphenylene ether resin, fluorinated polymer compound, and optional epoxy resin. This composite structure integrates the beneficial properties of each component, resulting in a material that exhibits excellent adhesiveness, heat resistance, and dielectric characteristics simultaneously.
2Reliability
If fluorine containing polymer compound is used to provide low dielectric constant and loss tangent, then dielectric characteristics are improved, but compatibility with other resins and adhesiveness deteriorate
Solution Approach 1:
The patent uses polyphenylene ether resin as an intermediary component that bridges the fluorinated polymer compound and other resin materials. The polyphenylene ether resin provides good compatibility and adhesiveness while the fluorinated polymer contributes low dielectric properties, allowing the composition to achieve both low dielectric constant and excellent adhesiveness through the mediating role of the polyphenylene ether resin.
Solution Approach 2:
The invention merges fluorinated polymer compound with polyphenylene ether resin in specific proportions to create a synergistic effect. The fluorinated polymer provides low dielectric characteristics while the polyphenylene ether resin ensures good adhesiveness and compatibility, resolving the contradiction between dielectric performance and adhesiveness.
3Strength
If epoxy resin is added to improve adhesiveness in polyphenylene ether resin, then adhesiveness is improved, but dielectric characteristics worsen due to generation of polar alcoholic hydroxy groups
Solution Approach 1:
The patent extracts the adhesiveness function from epoxy resin and assigns it to polyphenylene ether resin, while removing the harmful effect (generation of polar hydroxy groups that worsen dielectric characteristics). By using polyphenylene ether resin as the primary adhesive component and combining it with fluorinated polymer, the composition achieves excellent adhesiveness without the dielectric penalty associated with epoxy resin curing byproducts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting resin composition exhibits excellent flexibility, heat resistance, water resistance, and dielectric characteristics, along with high adhesiveness, making it suitable for electronic device applications.
Implementation Method 1
can provide the curing reaction with a radical initiator
Data Source
AI summary
A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.