Polyphenylene Ether Curable Composition for Low Dielectric Wiring Boards
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Solution Overview
Problem
The use of epoxy resin in wiring board materials results in high signal attenuation and heat generation due to insufficient low dielectric properties, and polyphenylene ethers with improved heat resistance are limited by their solubility in highly toxic solvents, making them difficult to handle and process effectively.
Innovation Solution
A curable composition comprising a polyphenylene ether with a branched structure and specific additives such as maleimide groups, triazine-based compounds, and crosslinked polystyrene particles, which are soluble in non-toxic organic solvents like cyclohexanone, maintaining excellent low dielectric properties and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyphenylene ether is used to achieve low dielectric properties, then signal attenuation is reduced, but the resin is soluble only in highly toxic solvents like chloroform and toluene, making it difficult to handle and process
Solution Approach 1:
The invention modifies the molecular structure of polyphenylene ether by introducing specific substituents (allyl groups, hydroxyl groups, carboxyl groups) at controlled ratios. This changes the chemical parameters of the resin, enabling it to dissolve in non-toxic solvents while maintaining low dielectric properties. The substitution ratio is precisely controlled to balance solubility and dielectric performance.
Solution Approach 2:
The invention creates a composite resin system by combining modified polyphenylene ether with other polymers (polycarbonate, polybutadiene, styrene-butadiene copolymer) in specific ratios. This composite approach enhances both the solubility in non-toxic solvents and the mechanical properties while preserving the low dielectric characteristics of the base polyphenylene ether.
2Temperature
If polyphenylene ether is modified to improve heat resistance, then thermal properties are enhanced, but solubility is limited to highly toxic solvents
Solution Approach 1:
The invention introduces hydroxyl groups and carboxyl groups in addition to allyl groups, creating a multi-functional modified polyphenylene ether. These functional groups enable hydrogen bonding and other interactions that improve heat resistance while the specific substitution pattern maintains solubility in non-toxic solvents like cyclohexanone and methyl ethyl ketone.
Solution Approach 2:
The invention uses specific solvents (cyclohexanone, methyl ethyl ketone, ethyl acetate) as intermediaries to dissolve the modified polyphenylene ether. These solvents act as mediators that bridge the gap between the modified resin structure and practical processing requirements, enabling safe and effective handling without toxic solvents.
3Ease of operation
If a linear polyphenylene ether structure is used, then the resin maintains good solubility, but mechanical properties are insufficient for wiring board applications
Solution Approach 1:
The invention combines modified polyphenylene ether with structural polymers like polycarbonate and flexible polymers like polybutadiene in optimized ratios. This composite structure provides both the solubility benefits of the modified PPE and the mechanical strength requirements for wiring boards, achieving a balance between processability and performance.
Solution Approach 2:
The invention introduces functional groups at specific locations and ratios within the polyphenylene ether molecule. By controlling the substitution pattern and ratio of different groups (allyl, hydroxyl, carboxyl), the resin achieves local modifications that enhance mechanical properties while maintaining overall solubility characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves improved solubility and mechanical properties, enabling the production of films with enhanced tensile strength and low dielectric constants, suitable for electronic components in high-frequency applications.
Implementation Method 1
a polyphenylene ether having a functional group including an unsaturated carbon bond... and at least any one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles
Data Source
AI summary
Provided is a curable composition that is soluble in various solvents (organic solvents other than highly toxic organic solvents, for example, cyclohexanone) while maintaining excellent low dielectric properties, wherein a film obtained by curing the curable composition has excellent mechanical properties. A curable composition, comprising: a polyphenylene ether having a functional group including an unsaturated carbon bond, which is obtained from raw material phenols including phenols satisfying at least condition 1 (having a hydrogen atom at an ortho position and a para position), and having a slope calculated by a conformation plot of less than 0.6; and at least one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles.