Polyphenylene Ether Resin Composition Crosslinking

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Solution Overview

Problem

High molecular weight polyphenylene ether resins exhibit poor solubility, compatibility with epoxy resin, high melting viscosity, and insufficient heat resistance, leading to reliability issues in laminate plates, particularly in high-frequency applications.

Innovation Solution

A polyphenylene ether resin composition comprising 100 parts by weight of polyphenylene ether resin, 25 to 40 parts by weight of copolymer, and 0.01 to 0.02 parts by weight of initiator, where the copolymer is formed through radical polymerization of mono-functional, bi-functional, and tri-functional monomers, along with a silane coupling agent and silicon oxide, to enhance crosslinking density and flowability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If polyphenylene ether resin with high molecular weight is used, then mechanical strength and dielectric properties are improved, but solubility, compatibility with epoxy resin, and melting viscosity deteriorate

Engineering Contradiction:

Improvemechanical strengthVSAvoidsolubility and compatibility

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The high molecular weight polyphenylene ether resin is segmented into lower molecular weight fractions through controlled hydrolysis, improving solubility and compatibility while maintaining mechanical strength through subsequent crosslinking

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A composite resin system is formed by combining polyphenylene ether with epoxy resin and crosslinking agents, achieving both good processability and mechanical strength through synergistic material combination

Inventive Principle:

Principle #40Composite materials

2Reliability

If polyphenylene ether resin with high molecular weight is used, then dielectric properties are improved, but melting viscosity increases

Engineering Contradiction:

Improvedielectric propertiesVSAvoidmelting viscosity

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The molecular weight parameter of polyphenylene ether is changed from high to lower range, reducing melting viscosity while maintaining dielectric properties through optimized resin composition and crosslinking structure

Inventive Principle:

Principle #35Parameter changes

3Reliability

If TAIC is used as curing agent, then dielectric constant is reduced, but glass transition temperature decreases

Engineering Contradiction:

Improvedielectric constantVSAvoidglass transition temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

Multiple crosslinking mechanisms are merged by combining TAIC with other crosslinking agents and incorporating silane-modified components, achieving both low dielectric constant and high glass transition temperature through synergistic effects

Inventive Principle:

Principle #5Merging (Combining)

4Strength

If styrene-based monomer and divinyl monomer are used as crosslinking components, then crosslinking is achieved, but vaporization occurs leading to short gelling period and unstable glass transition temperature

Engineering Contradiction:

ImprovecrosslinkingVSAvoidgelling period and glass transition temperature stability

Core Design Contradiction:

StrengthVSStability of the object's composition

Solution Approach 1:

Volatile monomers are replaced with non-volatile or low-volatility crosslinking agents, eliminating vaporization issues while maintaining crosslinking effectiveness and composition stability

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

Silane coupling agents serve as intermediaries between the polyphenylene ether resin and crosslinking network, providing stable crosslinking without vaporization and ensuring consistent gelling behavior and glass transition temperature

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved heat resistance, peel strength, and stable dielectric properties, including a higher glass transition temperature and low dielectric constant, addressing the limitations of high molecular weight polyphenylene ether resins.

Implementation Method 1

the copolymer is (A) copolymer polymerized of (a) mono-functional monomer, (b1) bi-functional monomer, and (c) tri-functional monomer through radical polymerization

Methodology Applied

Scientific EffectRadical polymerization: Photopolymerisation

Implementation Method 2

along with a silane coupling agent and silicon oxide, to enhance crosslinking density and flowability

Methodology Applied

Scientific EffectCrosslinking: Chemical Bonding

Implementation Method 3

the polyphenylene ether has excellent dielectric properties such as a low dielectric constant and low dielectric loss

Methodology Applied

Scientific EffectDielectric properties: Dielectric

Data Source

PatentUS10167389B2Polyphenylene ether resin composition

Publication Date: 2019.01.01 GRAND TEK ADVANCE MATERIAL SCI

AI summary

Polyphenylene ether resin composition includes 100 parts by weight of polyphenylene ether resin, 25 to 40 parts by weight of copolymer, and 0.01 to 0.02 parts by weight of initiator. The copolymer is (A) copolymer polymerized of (a) mono-functional monomer, (b1) bi-functional monomer, and (c) tri-functional monomer through radical polymerization, (B) copolymer polymerized of (a) mono-functional monomer and (b2) bi-functional monomer through radical polymerization, or (C) a combination thereof.