Poly(phenylene ether) Solubility via Ortho-Para Substitution

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Solution Overview

Problem

Poly(phenylene ether) materials face challenges with limited solvent solubility, particularly requiring highly toxic solvents like chloroform or toluene, making handling and curing for wiring boards difficult due to poor dielectric characteristics at higher frequencies.

Innovation Solution

A poly(phenylene ether) is developed with specific phenol raw materials that have hydrogen atoms in ortho and para positions and functional groups with unsaturated carbon bonds, allowing for solubility in non-toxic solvents like cyclohexanone and maintaining low-dielectric characteristics, combined with a curable composition including silica, cellulose nanofibers, and other additives for improved properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If poly(phenylene ether) is synthesized to achieve low-dielectric characteristics, then dielectric loss is reduced, but solvent solubility is limited requiring highly toxic solvents like chloroform or toluene

Engineering Contradiction:

Improvedielectric lossVSAvoidtoxicity of solvent

Core Design Contradiction:

Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The invention changes the chemical structure parameters of the poly(phenylene ether) by introducing specific substituents (allyl groups at ortho and/or para positions) to modify the polymer's solubility characteristics while maintaining low-dielectric properties. This structural parameter change enables the material to be soluble in non-toxic solvents like cyclohexanone

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite material system by combining poly(phenylene ether) with specific additives including silica, cellulose nanofibers, and curable agents. This composite approach enhances both the solubility in non-toxic solvents and the dielectric characteristics of the final wiring board material

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If poly(phenylene ether) is made soluble in non-toxic solvents like cyclohexanone, then ease of handling is improved, but heat resistance may be compromised

Engineering Contradiction:

Improveease of handlingVSAvoidheat resistance

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The invention incorporates curable agents (epoxy resins, polyisocyanates, or metal salts) into the poly(phenylene ether) formulation in advance. These agents are preliminarily mixed with the polymer in non-toxic solvents to create a handleable coating composition, which is then cured later to achieve both ease of handling during application and high heat resistance in the final product

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention utilizes phase transition from soluble state to crosslinked network structure. The poly(phenylene ether) is initially in a soluble phase allowing easy handling and coating application, then undergoes a chemical phase transition through curing reactions (epoxy ring-opening, isocyanate-amine reactions, or metal complexation) to form an insoluble crosslinked network that provides heat resistance

Inventive Principle:

Principle #36Phase transitions

3Ease of manufacture

If epoxy resin is used as wiring board material, then manufacturing is simplified, but dielectric loss increases at higher frequencies

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoiddielectric loss

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The invention creates a composite material combining poly(phenylene ether) with curable agents and additives to achieve wiring board material that maintains manufacturing simplicity while providing superior dielectric characteristics. The composite formulation includes silica and cellulose nanofibers that enhance dielectric properties without complicating the manufacturing process

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention changes the fundamental chemical composition parameter from epoxy resin to poly(phenylene ether) with specific substituents, which fundamentally alters the dielectric properties to reduce dielectric loss at high frequencies while maintaining ease of manufacture through similar coating and curing processes

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12054611B2Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component

Publication Date: 2024.08.06 TAIYO HOLDINGS CO LTD

AI summary

The present invention provides a poly(phenylene ether) which retains low-dielectric characteristics and is soluble in various solvents. The poly(phenylene ether) is characterized by being obtained from one or more raw-material phenols including a phenol satisfying at least Requirement 1 (to have hydrogen atoms in the ortho and para positions) and by having a slope calculated from a conformational plot of less than 0.6.