Polysilazane Bonding Layer for LED Wafer Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional silicone adhesives used in wavelength converted LEDs do not cut cleanly during wafer saw dicing, posing a challenge for manufacturing, while alternative adhesives must maintain optical clarity and thermal stability.
Innovation Solution
A polysilazane polymer-based bonding layer is used, which can include a free-radically polymerizable monomer like a (meth)acrylate, allowing for dual curing mechanisms and maintaining optical clarity and thermal stability, thereby addressing the cutting issue during dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicone adhesives are used for bonding wavelength converter to LED, then optical clarity and thermal stability are improved, but cutting cleanliness during dicing deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding layer by using polysilazane polymer instead of silicone adhesive. This material substitution fundamentally alters the bonding layer's properties, providing both excellent optical clarity and thermal stability while enabling clean cutting during dicing, thus resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The patent employs a composite bonding layer comprising polysilazane polymer combined with a free-radically polymerizable monomer such as (meth)acrylate. This composite material structure allows dual curing mechanisms (thermal and UV radiation curing) and achieves a balance between optical properties, thermal stability, and cutability during dicing
2Ease of manufacture
If polysilazane polymer with (meth)acrylate monomer is used, then ease of manufacture is improved through dual curing, but optical clarity and thermal stability may deteriorate due to monomer content
Solution Approach 1:
The patent applies partial action by incorporating a relatively low concentration of free-radically polymerizable (meth)acrylate monomer in the polysilazane bonding layer. This limited monomer content enables UV radiation curing capability without substantially compromising the optical clarity and thermal stability properties of the polysilazane material, thus achieving ease of manufacture through dual curing while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polysilazane polymer bonding layer provides clean cutting and high bond strength with excellent optical clarity and thermal stability, suitable for wavelength converted LEDs and other light-transmissive inorganic components, reducing adhesive residue and ensuring efficient manufacturing.
Implementation Method 1
A bonding layer attaches the LED wafer to the wavelength converter
Implementation Method 2
Compositions comprising a (meth)acrylate monomer can advantageously be radiation cured to maintain the positioning of the assembled components prior to completion of curing by thermal curing
Implementation Method 3
excellent thermal stability
Data Source
AI summary
In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.