Polysilicon Emitter Biristor for Low-Voltage DRAM Reliability

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Solution Overview

Problem

Conventional DRAM devices face challenges in miniaturization of capacitors while maintaining capacitance, leading to reliability and durability issues due to high driving voltages required for memory state operations in capacitorless DRAMs.

Innovation Solution

A two-terminal biristor is designed with a polysilicon layer inserted between the emitter semiconductor region and the metallic layer to increase current gain, decrease latch-up and latch-down voltages, and expand the latch voltage window, manufactured through methods such as ion implantation or epitaxial growth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If capacitorless DRAM is used for miniaturization, then cell size is reduced and integration is improved, but high driving voltage is required causing gate insulating layer deterioration

Engineering Contradiction:
Improvecell sizeVSAvoidgate insulating layer durability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

A polysilicon layer is introduced as an intermediary between the emitter semiconductor region and the metallic layer. This intermediate layer modifies the electrical characteristics at the interface, enabling lower operating voltages that prevent gate insulating layer deterioration while maintaining the capacitorless DRAM structure for miniaturization.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The polysilicon layer changes the electrical parameters (current gain, latch-up voltage, latch-down voltage) of the biristor structure. By adjusting these parameters through the polysilicon layer, the device operates at lower voltages, solving the reliability issue while preserving the miniaturized cell structure.

Inventive Principle:
Principle #35Parameter changes

2Power

If polysilicon layer is inserted to increase current gain, then latch-up voltage and latch-down voltage decrease and latch voltage window increases, but device structure becomes more complex

Engineering Contradiction:
Improvecurrent gainVSAvoidstructure complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The emitter region is segmented by introducing a distinct polysilicon layer between the emitter semiconductor region and metallic layer. This segmentation allows independent optimization of electrical characteristics while maintaining a relatively simple overall device structure suitable for manufacturing.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances current gain, reduces latch-up and latch-down voltages, and increases the latch voltage window, enabling low-power driving and improving the reliability and durability of memory devices like DRAMs.

Implementation Method 1

a polysilicon layer is inserted between an emitter semiconductor region and a metallic layer to increase a current gain

Methodology Applied
Scientific EffectElectrical Conductivity: Conduction (electrical)

Implementation Method 2

forming a first semiconductor layer of a first type on a substrate, forming a second semiconductor layer of a second type on the first semiconductor layer, and forming a third semiconductor layer of the first type on the second semiconductor layer

Methodology Applied
Scientific EffectIon Implantation: Ion Implantation

Data Source

PatentUS11329157B2Two-terminal biristor with polysilicon emitter layer and method of manufacturing the same
Publication Date: 2022.05.10 KOREA ADVANCED INST OF SCI & TECH
  • US11329157B2 patent drawing
  • US11329157B2 patent drawing
  • US11329157B2 patent drawing

AI summary

A two-terminal biristor in which a polysilicon emitter layer is inserted and a method of manufacturing the same are provided. The method of manufacturing the two-terminal biristor according to an embodiment of the present disclosure includes forming a first semiconductor layer of a first type on a substrate, forming a second semiconductor layer of a second type on the first semiconductor layer, forming a third semiconductor layer of the first type on the second semiconductor layer, and forming a polysilicon layer of the first type on the third semiconductor layer.