Polysiloxane Adhesive for POLED Panel Bonding
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Solution Overview
Problem
Adhesive sheets with high initial adhesive strength pose challenges in removing bubbles and foreign substances during bonding, and require re-adhesion, which is difficult, especially when removing adhesive sheets from plastic organic light-emitting diode (POLED) panels, leading to potential damage and increased adhesive strength over time.
Innovation Solution
An adhesive composition comprising a (meth)acrylate-based resin and a polymer with a melting temperature of 53° C. or higher, formed by copolymerizing monofunctional polysiloxane with two or more types of monomers, providing low initial adhesive strength that increases after a specific process, ensuring sufficient strength for fixing the base without damaging the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high adhesive strength is used to securely fix the base, then fixation reliability is improved, but bubble removal and re-adhesion capability deteriorate
Solution Approach 1:
The adhesive composition dynamically changes its adhesive strength based on temperature conditions. At lower temperatures during initial bonding, the adhesive maintains moderate strength allowing bubble removal and re-adhesion. After heating treatment, the adhesive transitions to high strength for secure fixation, resolving the contradiction between initial ease of operation and final reliability.
Solution Approach 2:
The patent changes the temperature parameter to control adhesive strength. By using a polymer with melting point of 53°C or higher, the adhesive maintains low initial strength at room temperature for easy bubble removal, then transitions to high strength after heating, simultaneously satisfying both bubble removal requirement and fixation reliability requirement.
2Reliability
If high adhesive strength is maintained from the beginning, then fixation reliability is improved, but ease of removal during processing deteriorates
Solution Approach 1:
The adhesive strength dynamically adapts to different process stages. During initial bonding and processing, the adhesive maintains low strength for easy removal. After heating treatment, it transitions to high strength for secure fixation, enabling both ease of manufacture during processing and reliability in final product.
Solution Approach 2:
The adhesive composition is designed to preliminarily maintain low adhesive strength during the bonding process, allowing easy removal and repositioning if needed. The high strength is activated only after the heating treatment is completed, ensuring that during manufacturing processes, removal is easy while final fixation is reliable.
3Reliability
If adhesive strength increases over time without processing, then fixation reliability is improved, but panel damage risk increases
Solution Approach 1:
The patent uses temperature as a control parameter to prevent premature strength increase. The polymer with melting point of 53°C or higher maintains low adhesive strength at room temperature during storage and handling, preventing panel damage. Only after intentional heating treatment does the adhesive activate high strength, ensuring reliability without causing harm during storage.
Solution Approach 2:
The adhesive composition provides beforehand protection by maintaining low initial strength during storage and handling periods. This prevents premature bonding and potential damage to the panel before the intended heating treatment, cushioning against the harmful effect of excessive adhesive strength during vulnerable periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition maintains low initial adhesive strength for easy removal and subsequent high adhesive strength after processing, preventing damage and ensuring secure fixation of the base, while maintaining stability and variable performance characteristics.
Implementation Method 1
a polymer having a melting temperature (Tm) of 53° C. or higher
Data Source
AI summary
An adhesive composition, an adhesive film comprising the same, a backplate film comprising the adhesive film, and a plastic organic light emitting display comprising the adhesive film are provided. The adhesive composition includes a (meth)acrylate-based resin, and a polymer having a melting temperature (Tm) of 53° C. or higher, wherein the polymer is a copolymer of a monofunctional polysiloxane and two or more types of monomers.