Epoxy-Modified Polysiloxane Adhesive for Wafer Thinning Detachment
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Solution Overview
Problem
Conventional temporary adhesives for semiconductor wafers fail to provide adequate stress resistance during polishing while ensuring easy detachment, leading to potential wafer breakage or deformation, and do not offer sufficient heat resistance for three-dimensional integration processes.
Innovation Solution
A temporary adhesive comprising a component cured by hydrosilylation reaction and an epoxy-modified polyorganosiloxane, with a specific mass ratio, that forms a strong bond during polishing and easily separates after processing, providing excellent spin coating properties and heat resistance for three-dimensional wafer integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a temporary adhesive with high adhesion force is used to resist polishing stress, then the wafer remains firmly attached during polishing, but the wafer becomes difficult to detach after polishing
Solution Approach 1:
The adhesive composition uses a specific ratio of component (A) to component (B) ranging from 99.995:0.005 to 30:70 by mass, where component (A) provides strong adhesion through hydrosilylation curing and component (B) enables easy detachment. This parameter optimization allows the adhesive to exhibit high adhesion force during polishing while maintaining easy detachability after processing.
Solution Approach 2:
The temporary adhesive is formulated as a composite material combining component (A) to be cured by hydrosilylation reaction and component (B) containing epoxy-modified polyorganosiloxane. This composite structure integrates the strong bonding capability of hydrosilylation-cured adhesive with the easy separation property of epoxy-modified polyorganosiloxane, resolving the contradiction between strong attachment and easy detachment.
2Ease of operation
If the adhesive is made to provide easy detachment after polishing, then the wafer can be easily separated from the support, but the adhesive fails to resist polishing stress adequately
Solution Approach 1:
By optimizing the mass ratio of component (A) to component (B) within the range of 99.995:0.005 to 30:70, the adhesive achieves the right balance between stress resistance during polishing and ease of detachment after polishing. The specific composition parameters enable the adhesive to provide sufficient bonding strength during the polishing process while maintaining easy separability afterward.
Solution Approach 2:
The composite adhesive system combines component (A) for strong stress resistance through hydrosilylation curing with component (B) containing epoxy-modified polyorganosiloxane for easy detachment. This material composition allows the adhesive to simultaneously provide adequate polishing stress resistance and easy post-processing detachment.
3Reliability
If a conventional temporary adhesive is used, then the wafer can be attached to the support, but the adhesive lacks sufficient heat resistance for three-dimensional integration processes
Solution Approach 1:
The adhesive composition parameters are optimized with component (A) to component (B) mass ratio from 99.995:0.005 to 30:70, where the epoxy-modified polyorganosiloxane in component (B) contributes excellent heat resistance properties. This parameter optimization enables the adhesive to withstand high temperatures during three-dimensional integration processes while maintaining ease of manufacture through a simple two-component formulation.
Solution Approach 2:
The composite adhesive combining component (A) and component (B) containing epoxy-modified polyorganosiloxane provides enhanced heat resistance for three-dimensional integration processes. The epoxy-modified polyorganosiloxane component specifically contributes thermal stability, allowing the adhesive to maintain its bonding properties under elevated temperatures during wafer processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive ensures easy separation of the wafer from the support after polishing, maintains heat resistance during processing, and facilitates three-dimensional mounting with improved mechanical properties, allowing for successful thinning and through silicon via (TSV) formation without wafer damage.
Implementation Method 1
containing a component (A) to be cured by a hydrosilylation reaction
Implementation Method 2
a component (B) containing an epoxy-modified polyorganosiloxane
Data Source
AI summary
There are provided a temporary adhesive that has excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing a adhesive attached to the wafer or the support after the separation, a layered body using the temporary adhesive, and a processing method using the layered body. An adhesive used to separatably attach a support to a circuit side of a wafer and process a rear surface of the wafer, the adhesive containing a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5. A method for forming a layered body including a first step of applying the adhesive to a surface of a first body to form an adhesion layer, a second step of attaching a surface of a second body to the adhesion layer, and a third step of heating the adhesion layer from a side of the first body to cure the adhesion layer.