Polysiloxane Composition Low-Temperature Curing Stability
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Solution Overview
Problem
Existing polysiloxane compositions require high temperatures for curing, which can lead to unwanted reactions with other materials in the device manufacturing process, and they lack good storage stability and low-temperature curing capabilities.
Innovation Solution
A polysiloxane composition comprising a polysiloxane with specific repeating units, an ionic liquid, an acid, and a solvent, which allows for low-temperature curing and improved storage stability, and can be used to manufacture cured films and electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If polysiloxane is cured at elevated temperature to proceed rapidly with condensation reaction, then curing speed is improved, but unwanted reactions with other materials in device manufacturing process occur
Solution Approach 1:
The patent changes the curing temperature parameter from conventional elevated temperatures to low temperature (below 100°C). This is achieved by formulating a composition with specific components including polysiloxane with controlled silanol content, silylating agent, and catalyst that enables the condensation reaction to proceed rapidly at low temperatures, thereby avoiding unwanted reactions with other materials in the device manufacturing process
2Temperature
If conventional polysiloxane composition is used, then high-temperature curing is achieved, but storage stability deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-controlling the silanol group content in the polysiloxane and pre-formulating the composition with specific silylating agents and catalysts. This preliminary preparation ensures that the composition remains stable during storage with minimal premature reaction, while being ready to cure rapidly at low temperature when activated, thus resolving the contradiction between high-temperature curing capability and storage stability
3Reliability
If polysiloxane with high silanol content is used, then curing reactivity is improved, but storage stability deteriorates due to premature condensation reaction
Solution Approach 1:
The patent optimizes the silanol content parameter to a specific range (0.01 to 5.0 mmol/g, preferably 0.05 to 2.0 mmol/g) rather than using high silanol content. This parameter optimization, combined with the addition of silylating agents and catalysts, maintains sufficient curing reactivity while preventing premature condensation during storage, thus resolving the contradiction between curing reactivity and storage stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition can be cured at lower temperatures than traditional thermally curable compositions, exhibits good storage stability, and produces films with minimal film shrinkage, uniform thickness, low elastic modulus, and excellent filling properties, making it suitable for various applications including semiconductor devices and optical devices.
Implementation Method 1
the coating film is heated at an elevated temperature to rapidly proceed with a condensation reaction of silanol groups in the polysiloxane
Implementation Method 2
A polysiloxane composition comprising (I) a polysiloxane including a repeating unit represented by the formula (Ia) and having silanol at the end or side chain... (II) an ionic liquid... (III) an acid
Data Source
AI summary
A polysiloxane composition capable of being cured at a low temperature and having good storage stability is provided in a composition that includes (I) a polysiloxane having a certain structure as defined herein, (II) an ionic liquid, (III) an acid, and (IV) a solvent.