Cleaning Composition for Polysiloxane Residue on Semiconductor Substrates
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Solution Overview
Problem
Existing cleaning agents are ineffective in efficiently removing polysiloxane adhesive residue from semiconductor substrates without causing substrate corrosion, particularly during high-temperature processing steps in 3-dimensional integration of semiconductor wafers.
Innovation Solution
A cleaning agent composition comprising tetrahydrocarbylammonium fluoride and an organic solvent with specific aromatic and lactam compounds, which effectively removes polysiloxane adhesive residue without corroding the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cleaning agents are used to remove polysiloxane adhesive residue, then cleaning effectiveness is reduced, but substrate corrosion is avoided
Solution Approach 1:
The patent changes the chemical parameters of the cleaning agent by using tetrahydrocarbylammonium fluoride instead of conventional cleaning agents. This parameter change enables high-efficiency removal of polysiloxane adhesive residue while maintaining substrate integrity, resolving the contradiction between cleaning efficiency and substrate corrosion prevention
Solution Approach 2:
The cleaning agent comprises a composite formulation containing tetrahydrocarbylammonium fluoride combined with specific organic solvents. This composite material approach achieves synergistic effects that enable effective adhesive removal without causing substrate damage, addressing the contradiction between cleaning performance and substrate protection
2Strength
If polysiloxane adhesive is used for temporary bonding, then bonding strength during polishing is improved, but adhesive residue remains after debonding
Solution Approach 1:
The patent extracts and removes the harmful adhesive residue generated by polysiloxane adhesive using a specialized cleaning agent. The tetrahydrocarbylammonium fluoride selectively targets and removes the residue while leaving the substrate intact, resolving the contradiction between achieving strong temporary bonding and eliminating residual adhesive
Solution Approach 2:
The cleaning agent converts the harmful adhesive residue into a removable substance through chemical interaction. The tetrahydrocarbylammonium fluoride reacts with the polysiloxane residue to facilitate its removal, transforming the harmful byproduct into something that can be easily eliminated
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning agent composition achieves high-efficiency removal of polysiloxane adhesive residue on semiconductor substrates in a short period, ensuring substrate integrity and suitability for high-temperature processing.
Implementation Method 1
a cleaning agent composition comprising tetrahydrocarbylammonium fluoride and an organic solvent
Implementation Method 2
an organic solvent containing an aromatic compound represented by formula (1) and a lactam compound represented by formula (2)
Data Source
AI summary
A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an aromatic compound represented by formula (1) and a lactam compound represented by formula (2).(in formulas (1) and (2), s represents the number of substituents R100s of the benzene ring and is 2 or 3; s groups of R100s each independently represent a C1 to C6 alkyl group; the total number of carbon atoms in s groups of C1 to C6 alkyl groups is 3 or greater; R101 represents a C1 to C6 alkyl group; and R102 represents a C1 to C6 alkylene group.)