Polysiloxane Resin Composition for Solid State Image Sensors
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Solution Overview
Problem
The downsizing of solid state image sensors has led to a decrease in light utilization efficiency and sensitivity, requiring photosensitive materials with high refractive index, high light transmittance, and high heat resistance, while also needing excellent pattern processability, which existing technologies, such as those disclosed in Patent Literatures 1 and 2, are insufficient in achieving.
Innovation Solution
A positive photosensitive resin composition comprising polysiloxane, a naphthoquinonediazide compound, and a solvent, with specific structural formulas and molar ratios of styryl and vinyl groups, which enhances refractive index, heat resistance, and pattern processability, and includes the use of metallic compound particles for improved properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polysiloxane resin is used to achieve high refractive index and heat resistance, then light transmittance and heat resistance are improved, but pattern processability deteriorates
Solution Approach 1:
The patent modifies the chemical structure parameters of polysiloxane by introducing specific functional groups (vinyl, styryl, acryloyloxy) at controlled ratios. This changes the polymer's reactivity and curing characteristics, enabling the material to achieve both high heat resistance and good pattern processability through parameter optimization rather than fundamental material change
Solution Approach 2:
The patent creates a composite resin system combining polysiloxane base resin with multiple types of functional groups and crosslinking agents. This composite approach allows the material to exhibit both the inherent heat resistance of polysiloxane and the pattern formability provided by the reactive functional groups, resolving the contradiction between these two properties
2Volume of moving object
If sensor size is reduced to achieve smaller solid state image sensors, then device miniaturization is improved, but light utilization efficiency deteriorates
Solution Approach 1:
The patent applies microlens structures with high refractive index polysiloxane resin at specific locations (on the color filter at light intake by pixels) to concentrate light locally. This local optimization of light gathering capability compensates for the overall sensor size reduction, maintaining light utilization efficiency despite miniaturization
3Ease of manufacture
If existing photosensitive materials are used to achieve simplicity, then ease of manufacture is improved, but refractive index and pattern processability deteriorate
Solution Approach 1:
The patent develops a polysiloxane-based photosensitive resin that serves multiple functions simultaneously: it provides high refractive index for light condensation, good pattern processability for microlens formation, and serves as the primary structural material. This multi-functional material eliminates the need for separate materials for each function, maintaining ease of manufacture while improving performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition demonstrates high refractive index, light transmittance, heat resistance, and excellent pattern processability, enabling efficient light condensation and pattern formation without the need for etching, thus addressing the sensitivity and efficiency issues in solid state image sensors.
Implementation Method 1
the compound (B) which has a naphthoquinonediazide structure and undergoes photodecomposition to generate a carboxylic acid
Implementation Method 2
polysiloxane (A) having at least one structure selected from general formulae (1) to (3) and at least one structure selected from general formulae (4) to (6)
Data Source
AI summary
The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6);in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group;in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.